Abstract
Phase formation and surface hardening in the 100-nm-thick Al(film)/Ti(substrate) system under conditions of pulsed electron-beam melting (~15 keV, ~3 μs, 3-4 J/cm2) have been studied depending on the number of film deposition-melting cycles. Using this method, submicrocrystalline and nanocrystalline surface alloys with thicknesses ≥3 μm based on Ti3Al and TiAl intermetallics have been obtained on the titanium substrate.
Original language | English |
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Pages (from-to) | 226-229 |
Number of pages | 4 |
Journal | Technical Physics Letters |
Volume | 37 |
Issue number | 3 |
DOIs | |
Publication status | Published - 1 Mar 2011 |
ASJC Scopus subject areas
- Physics and Astronomy (miscellaneous)