Superhard nanocrystalline Ti-Cu-N coatings deposited by vacuum arc evaporation of a sintered cathode

Yu F. Ivanov, N. N. Koval, O. V. Krysina, T. Baumbach, S. Doyle, T. Slobodsky, N. A. Timchenko, R. M. Galimov, A. N. Shmakov

Research output: Contribution to journalArticle

39 Citations (Scopus)


Experimental data are presented on the structure and properties of hardening nanocrystalline copper-added titanium nitride coatings produced by plasma-assisted vacuum arc evaporation of sintered cathodes. A model of the nanostructurization of this type of coating is proposed. According to the model, the nanocrystallization in these materials is due to the added atoms, which form an amorphous sheath around a grain that restricts the grain growth.

Original languageEnglish
Pages (from-to)430-434
Number of pages5
JournalSurface and Coatings Technology
Publication statusPublished - 25 Aug 2012



  • Nanocrystalline structure
  • Ti-Cu-N coating
  • Transmission electron microscopy
  • Vacuum-arc deposition
  • X-ray diffraction

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Materials Chemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

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