Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs

Cheng Chen, Denis Labrousse, Stéphane Lefebvre, Mickael Petit, Cyril Buttay, Hervé Morel

Research output: Contribution to journalArticlepeer-review

50 Citations (Scopus)


This paper presents experimental robustness tests made on Silicon Carbide (SiC) MOSFETs and SiC Bipolar Junction Transistors (BJTs) submitted to short-circuit operations (SC) or current limitation modes. For SiC MOSFETs, a gate leakage current is detected before failure without being responsible for the immediate failure. Nevertheless this gate leakage current is not without effect on the integrity of the SiC MOSFETs. Based on several robustness tests performed on SiC MOSFETs and on the comparison with experimental results obtained with SiC BJTs, the paper points out two main failure modes for SiC MOSFETs. The first one results in a simultaneously short circuit between drain and gate and drain and source and the second one in a degradation of the insulation between gate and source leading to a short circuit between gate and source. For some tested devices, the failure appears in a very interesting open state mode between drain and source after physical short-circuit between gate and source with a mode of failure very similar to those observed for SiC BJT.

Original languageEnglish
Pages (from-to)1708-1713
Number of pages6
JournalMicroelectronics Reliability
Issue number9-10
Publication statusPublished - 1 Aug 2015
Externally publishedYes


  • BJT
  • Short circuit
  • SiC

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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