Structure and mechanical properties of DC magnetron sputtered TiC/Cu films

J. Soldán, J. Musil

Research output: Contribution to journalArticle

36 Citations (Scopus)

Abstract

TiC/Cu nanocomposite films with various copper content were deposited by DC unbalanced magnetron sputtering from sintered TiC target fixed by Cu rings of different inner diameters in pure argon. This makes it possible to prepare TiC/Cu films with Cu content ranging from approximately 5 to 85 at% Cu. The structure (XRD, Raman, SEM) and mechanical properties were examined as a function of deposition parameters and Cu content in the film. Special attention is devoted to the total internal stress, parameters determining its magnitude and their correlation with mechanical properties. The TiC/Cu system is compared with similar nitride MeNx/Cu(Ni) (Me=Ti, Zr) systems and an explanation of the different behavior of nitride and carbide systems is proposed.

Original languageEnglish
Pages (from-to)531-538
Number of pages8
JournalVacuum
Volume81
Issue number4
DOIs
Publication statusPublished - 6 Nov 2006

Fingerprint

Nitrides
direct current
mechanical properties
Mechanical properties
nitrides
Nanocomposite films
Argon
Magnetron sputtering
Carbides
Copper
Residual stresses
carbides
Scanning electron microscopy
residual stress
magnetron sputtering
nanocomposites
argon
copper
scanning electron microscopy
rings

Keywords

  • Mechanical properties
  • Stress
  • Structure
  • TiC-Cu films

ASJC Scopus subject areas

  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films

Cite this

Structure and mechanical properties of DC magnetron sputtered TiC/Cu films. / Soldán, J.; Musil, J.

In: Vacuum, Vol. 81, No. 4, 06.11.2006, p. 531-538.

Research output: Contribution to journalArticle

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