Structural evolution of ultrafine-grained copper and copper-based alloy during plastic deformation

E. V. Kozlov, A. N. Zhdanov, L. N. Ignatenko, N. A. Popova, Yu F. Ivanov, N. A. Koneva

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

The dependence of stresses on the strain level and structural evolution of ultrafine-grained copper and a copper-based alloy during active plastic deformation at room temperature is studied in detail. Existence of short linear and parabolic work-hardening stages (stages II and III) in stress-strain curves and a long stage with nearly zero work-hardening coefficient are characteristic of the materials under study. It was revealed by transmission diffraction electron microscopy that at grain size of hundreds of nanometers, the in-grain dislocation slip and overslip along grain boundaries are the basic deformation mechanisms. The shear at grain boundaries and its contribution to the total shear are estimated. Changes in the grain structure and grain boundaries with strain level are analyzed. The scalar dislocation density and the internal stress field amplitude are measured. Special attention is paid to the contribution of grains of different size from the entire grain spectrum to the strain resistance. A composite model of the strain resistance of such materials is developed.

Original languageEnglish
Title of host publicationTMS Annual Meeting
EditorsY.T. Zhu, T.G. Langdon, R.S. Mishra, S.L. Semiatin, M.J. Saran, T.C. Lowe
Pages419-428
Number of pages10
Publication statusPublished - 2002
EventUltrafine Grained Materials II - Seattle, WA, United States
Duration: 17 Feb 200221 Feb 2002

Other

OtherUltrafine Grained Materials II
CountryUnited States
CitySeattle, WA
Period17.2.0221.2.02

Fingerprint

plastic deformation
grain boundary
Copper
Plastic deformation
copper
hardening
dislocation
Grain boundaries
Strain hardening
deformation mechanism
electron microscopy
diffraction
stress field
Crystal microstructure
Stress-strain curves
grain size
Dislocations (crystals)
Electron microscopy
Residual stresses
Diffraction

Keywords

  • Copper
  • Deformation
  • Structure
  • Ultrafine grain

ASJC Scopus subject areas

  • Geology
  • Metals and Alloys

Cite this

Kozlov, E. V., Zhdanov, A. N., Ignatenko, L. N., Popova, N. A., Ivanov, Y. F., & Koneva, N. A. (2002). Structural evolution of ultrafine-grained copper and copper-based alloy during plastic deformation. In Y. T. Zhu, T. G. Langdon, R. S. Mishra, S. L. Semiatin, M. J. Saran, & T. C. Lowe (Eds.), TMS Annual Meeting (pp. 419-428)

Structural evolution of ultrafine-grained copper and copper-based alloy during plastic deformation. / Kozlov, E. V.; Zhdanov, A. N.; Ignatenko, L. N.; Popova, N. A.; Ivanov, Yu F.; Koneva, N. A.

TMS Annual Meeting. ed. / Y.T. Zhu; T.G. Langdon; R.S. Mishra; S.L. Semiatin; M.J. Saran; T.C. Lowe. 2002. p. 419-428.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kozlov, EV, Zhdanov, AN, Ignatenko, LN, Popova, NA, Ivanov, YF & Koneva, NA 2002, Structural evolution of ultrafine-grained copper and copper-based alloy during plastic deformation. in YT Zhu, TG Langdon, RS Mishra, SL Semiatin, MJ Saran & TC Lowe (eds), TMS Annual Meeting. pp. 419-428, Ultrafine Grained Materials II, Seattle, WA, United States, 17.2.02.
Kozlov EV, Zhdanov AN, Ignatenko LN, Popova NA, Ivanov YF, Koneva NA. Structural evolution of ultrafine-grained copper and copper-based alloy during plastic deformation. In Zhu YT, Langdon TG, Mishra RS, Semiatin SL, Saran MJ, Lowe TC, editors, TMS Annual Meeting. 2002. p. 419-428
Kozlov, E. V. ; Zhdanov, A. N. ; Ignatenko, L. N. ; Popova, N. A. ; Ivanov, Yu F. ; Koneva, N. A. / Structural evolution of ultrafine-grained copper and copper-based alloy during plastic deformation. TMS Annual Meeting. editor / Y.T. Zhu ; T.G. Langdon ; R.S. Mishra ; S.L. Semiatin ; M.J. Saran ; T.C. Lowe. 2002. pp. 419-428
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