Abstract
The dependence of stresses on the strain level and structural evolution of ultrafine-grained copper and a copper-based alloy during active plastic deformation at room temperature is studied in detail. Existence of short linear and parabolic work-hardening stages (stages II and III) in stress-strain curves and a long stage with nearly zero work-hardening coefficient are characteristic of the materials under study. It was revealed by transmission diffraction electron microscopy that at grain size of hundreds of nanometers, the in-grain dislocation slip and overslip along grain boundaries are the basic deformation mechanisms. The shear at grain boundaries and its contribution to the total shear are estimated. Changes in the grain structure and grain boundaries with strain level are analyzed. The scalar dislocation density and the internal stress field amplitude are measured. Special attention is paid to the contribution of grains of different size from the entire grain spectrum to the strain resistance. A composite model of the strain resistance of such materials is developed.
| Original language | English |
|---|---|
| Title of host publication | TMS Annual Meeting |
| Editors | Y.T. Zhu, T.G. Langdon, R.S. Mishra, S.L. Semiatin, M.J. Saran, T.C. Lowe |
| Pages | 419-428 |
| Number of pages | 10 |
| Publication status | Published - 2002 |
| Event | Ultrafine Grained Materials II - Seattle, WA, United States Duration: 17 Feb 2002 → 21 Feb 2002 |
Other
| Other | Ultrafine Grained Materials II |
|---|---|
| Country | United States |
| City | Seattle, WA |
| Period | 17.2.02 → 21.2.02 |
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Keywords
- Copper
- Deformation
- Structure
- Ultrafine grain
ASJC Scopus subject areas
- Geology
- Metals and Alloys
Cite this
Structural evolution of ultrafine-grained copper and copper-based alloy during plastic deformation. / Kozlov, E. V.; Zhdanov, A. N.; Ignatenko, L. N.; Popova, N. A.; Ivanov, Yu F.; Koneva, N. A.
TMS Annual Meeting. ed. / Y.T. Zhu; T.G. Langdon; R.S. Mishra; S.L. Semiatin; M.J. Saran; T.C. Lowe. 2002. p. 419-428.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Structural evolution of ultrafine-grained copper and copper-based alloy during plastic deformation
AU - Kozlov, E. V.
AU - Zhdanov, A. N.
AU - Ignatenko, L. N.
AU - Popova, N. A.
AU - Ivanov, Yu F.
AU - Koneva, N. A.
PY - 2002
Y1 - 2002
N2 - The dependence of stresses on the strain level and structural evolution of ultrafine-grained copper and a copper-based alloy during active plastic deformation at room temperature is studied in detail. Existence of short linear and parabolic work-hardening stages (stages II and III) in stress-strain curves and a long stage with nearly zero work-hardening coefficient are characteristic of the materials under study. It was revealed by transmission diffraction electron microscopy that at grain size of hundreds of nanometers, the in-grain dislocation slip and overslip along grain boundaries are the basic deformation mechanisms. The shear at grain boundaries and its contribution to the total shear are estimated. Changes in the grain structure and grain boundaries with strain level are analyzed. The scalar dislocation density and the internal stress field amplitude are measured. Special attention is paid to the contribution of grains of different size from the entire grain spectrum to the strain resistance. A composite model of the strain resistance of such materials is developed.
AB - The dependence of stresses on the strain level and structural evolution of ultrafine-grained copper and a copper-based alloy during active plastic deformation at room temperature is studied in detail. Existence of short linear and parabolic work-hardening stages (stages II and III) in stress-strain curves and a long stage with nearly zero work-hardening coefficient are characteristic of the materials under study. It was revealed by transmission diffraction electron microscopy that at grain size of hundreds of nanometers, the in-grain dislocation slip and overslip along grain boundaries are the basic deformation mechanisms. The shear at grain boundaries and its contribution to the total shear are estimated. Changes in the grain structure and grain boundaries with strain level are analyzed. The scalar dislocation density and the internal stress field amplitude are measured. Special attention is paid to the contribution of grains of different size from the entire grain spectrum to the strain resistance. A composite model of the strain resistance of such materials is developed.
KW - Copper
KW - Deformation
KW - Structure
KW - Ultrafine grain
UR - http://www.scopus.com/inward/record.url?scp=0036441115&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0036441115&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:0036441115
SP - 419
EP - 428
BT - TMS Annual Meeting
A2 - Zhu, Y.T.
A2 - Langdon, T.G.
A2 - Mishra, R.S.
A2 - Semiatin, S.L.
A2 - Saran, M.J.
A2 - Lowe, T.C.
ER -