Stress imaging in structural challenging MEMS with high sensitivity using micro-Raman spectroscopy

Peter Meszmer, Raul D. Rodriguez, Evgeniya Sheremet, Dietrich R.T. Zahn, Bernhard Wunderle

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

The development cycle of microelectromechanical systems (MEMS) includes several numerical simulation and optimization iterations. To verify and calibrate the models with experimental data, the non-destructive measurement and imaging of stress distribution in structural challenging regions with high sensitivity is of great importance. This is possible to achieve using micro-Raman spectroscopy. Due to limitations of commercially available software regarding flexibility and sensitivity, the authors developed an alternative approach which ensures that the quality of spectra is taken into account in the evaluating calculations. In this way a remarkable stress resolution below 20 MPa becomes possible even on structural challenging MEMS devices.

Original languageEnglish
Pages (from-to)104-110
Number of pages7
JournalMicroelectronics Reliability
Volume79
DOIs
Publication statusPublished - 1 Dec 2017

    Fingerprint

Keywords

  • FEM simulation
  • MEMS
  • Micro-Raman spectroscopy
  • Stress

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this