Abstract
The problem of coupling the heterogeneous materials has always been urgent. There are a lot of ways to solve this problem, but all of them have a number of disadvantages such as high costs, insecurity, etc. The plasma dynamic method is considered as the one of up-to-date solutions. This method allows coupling the heterogeneous materials (for example copper and aluminum, which are the most widely-used material in power engineering), in order to reduce energy losses in the transient contact resistance, by depositing copper on the aluminum contact surface using a coaxial magneto plasma accelerator. In process the accelerator generates a high-speed pulse jet of copper electric erosion plasma, which at high speeds affects the surface of aluminum substrate. A special setup was designed and constructed to determine and calculate the specific transient contact resistance of the obtained contact pairs. The obtained results show the possibility of combining copper and aluminum by depositing a copper coating on aluminum substrate using the plasma dynamic method. The proposed method allows not only coupling copper and aluminum, but also reducing the contact resistance, thereby reducing the energy losses in the transient contacts.
| Original language | English |
|---|---|
| Title of host publication | 2018 14th International Scientific-Technical Conference on Actual Problems of Electronic Instrument Engineering, APEIE 2018 - Proceedings |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 132-135 |
| Number of pages | 4 |
| ISBN (Electronic) | 9781538670545 |
| DOIs | |
| Publication status | Published - 26 Nov 2018 |
| Event | 14th International Scientific-Technical Conference on Actual Problems of Electronic Instrument Engineering, APEIE 2018 - Novosibirsk, Russian Federation Duration: 2 Oct 2018 → 6 Oct 2018 |
Conference
| Conference | 14th International Scientific-Technical Conference on Actual Problems of Electronic Instrument Engineering, APEIE 2018 |
|---|---|
| Country | Russian Federation |
| City | Novosibirsk |
| Period | 2.10.18 → 6.10.18 |
Fingerprint
Keywords
- aluminum substrate
- coaxial magneto plasma accelerator
- copper coating
- transient contact resistance
- voltage deviation
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Instrumentation
- Atomic and Molecular Physics, and Optics
Cite this
Research of Method about the Application of the Copper Coating Deposition on the Surface Using the High-Speed Plasma Jet. / Sivkov, Alexander A.; Shanenkova, Yuliya L.; Polovinkina, Yuliya N.
2018 14th International Scientific-Technical Conference on Actual Problems of Electronic Instrument Engineering, APEIE 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. p. 132-135 8545357.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Research of Method about the Application of the Copper Coating Deposition on the Surface Using the High-Speed Plasma Jet
AU - Sivkov, Alexander A.
AU - Shanenkova, Yuliya L.
AU - Polovinkina, Yuliya N.
PY - 2018/11/26
Y1 - 2018/11/26
N2 - The problem of coupling the heterogeneous materials has always been urgent. There are a lot of ways to solve this problem, but all of them have a number of disadvantages such as high costs, insecurity, etc. The plasma dynamic method is considered as the one of up-to-date solutions. This method allows coupling the heterogeneous materials (for example copper and aluminum, which are the most widely-used material in power engineering), in order to reduce energy losses in the transient contact resistance, by depositing copper on the aluminum contact surface using a coaxial magneto plasma accelerator. In process the accelerator generates a high-speed pulse jet of copper electric erosion plasma, which at high speeds affects the surface of aluminum substrate. A special setup was designed and constructed to determine and calculate the specific transient contact resistance of the obtained contact pairs. The obtained results show the possibility of combining copper and aluminum by depositing a copper coating on aluminum substrate using the plasma dynamic method. The proposed method allows not only coupling copper and aluminum, but also reducing the contact resistance, thereby reducing the energy losses in the transient contacts.
AB - The problem of coupling the heterogeneous materials has always been urgent. There are a lot of ways to solve this problem, but all of them have a number of disadvantages such as high costs, insecurity, etc. The plasma dynamic method is considered as the one of up-to-date solutions. This method allows coupling the heterogeneous materials (for example copper and aluminum, which are the most widely-used material in power engineering), in order to reduce energy losses in the transient contact resistance, by depositing copper on the aluminum contact surface using a coaxial magneto plasma accelerator. In process the accelerator generates a high-speed pulse jet of copper electric erosion plasma, which at high speeds affects the surface of aluminum substrate. A special setup was designed and constructed to determine and calculate the specific transient contact resistance of the obtained contact pairs. The obtained results show the possibility of combining copper and aluminum by depositing a copper coating on aluminum substrate using the plasma dynamic method. The proposed method allows not only coupling copper and aluminum, but also reducing the contact resistance, thereby reducing the energy losses in the transient contacts.
KW - aluminum substrate
KW - coaxial magneto plasma accelerator
KW - copper coating
KW - transient contact resistance
KW - voltage deviation
UR - http://www.scopus.com/inward/record.url?scp=85060125487&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85060125487&partnerID=8YFLogxK
U2 - 10.1109/APEIE.2018.8545357
DO - 10.1109/APEIE.2018.8545357
M3 - Conference contribution
AN - SCOPUS:85060125487
SP - 132
EP - 135
BT - 2018 14th International Scientific-Technical Conference on Actual Problems of Electronic Instrument Engineering, APEIE 2018 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
ER -