Research of Method about the Application of the Copper Coating Deposition on the Surface Using the High-Speed Plasma Jet

Alexander A. Sivkov, Yuliya L. Shanenkova, Yuliya N. Polovinkina

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The problem of coupling the heterogeneous materials has always been urgent. There are a lot of ways to solve this problem, but all of them have a number of disadvantages such as high costs, insecurity, etc. The plasma dynamic method is considered as the one of up-to-date solutions. This method allows coupling the heterogeneous materials (for example copper and aluminum, which are the most widely-used material in power engineering), in order to reduce energy losses in the transient contact resistance, by depositing copper on the aluminum contact surface using a coaxial magneto plasma accelerator. In process the accelerator generates a high-speed pulse jet of copper electric erosion plasma, which at high speeds affects the surface of aluminum substrate. A special setup was designed and constructed to determine and calculate the specific transient contact resistance of the obtained contact pairs. The obtained results show the possibility of combining copper and aluminum by depositing a copper coating on aluminum substrate using the plasma dynamic method. The proposed method allows not only coupling copper and aluminum, but also reducing the contact resistance, thereby reducing the energy losses in the transient contacts.

Original languageEnglish
Title of host publication2018 14th International Scientific-Technical Conference on Actual Problems of Electronic Instrument Engineering, APEIE 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages132-135
Number of pages4
ISBN (Electronic)9781538670545
DOIs
Publication statusPublished - 26 Nov 2018
Event14th International Scientific-Technical Conference on Actual Problems of Electronic Instrument Engineering, APEIE 2018 - Novosibirsk, Russian Federation
Duration: 2 Oct 20186 Oct 2018

Conference

Conference14th International Scientific-Technical Conference on Actual Problems of Electronic Instrument Engineering, APEIE 2018
CountryRussian Federation
CityNovosibirsk
Period2.10.186.10.18

Fingerprint

Plasma jets
plasma jets
high speed
aluminum
Copper
Aluminum
coatings
copper
Coatings
Contact resistance
contact resistance
plasma dynamics
Plasmas
Energy dissipation
energy dissipation
Plasma accelerators
plasma accelerators
Substrates
erosion
Particle accelerators

Keywords

  • aluminum substrate
  • coaxial magneto plasma accelerator
  • copper coating
  • transient contact resistance
  • voltage deviation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation
  • Atomic and Molecular Physics, and Optics

Cite this

Sivkov, A. A., Shanenkova, Y. L., & Polovinkina, Y. N. (2018). Research of Method about the Application of the Copper Coating Deposition on the Surface Using the High-Speed Plasma Jet. In 2018 14th International Scientific-Technical Conference on Actual Problems of Electronic Instrument Engineering, APEIE 2018 - Proceedings (pp. 132-135). [8545357] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APEIE.2018.8545357

Research of Method about the Application of the Copper Coating Deposition on the Surface Using the High-Speed Plasma Jet. / Sivkov, Alexander A.; Shanenkova, Yuliya L.; Polovinkina, Yuliya N.

2018 14th International Scientific-Technical Conference on Actual Problems of Electronic Instrument Engineering, APEIE 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. p. 132-135 8545357.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sivkov, AA, Shanenkova, YL & Polovinkina, YN 2018, Research of Method about the Application of the Copper Coating Deposition on the Surface Using the High-Speed Plasma Jet. in 2018 14th International Scientific-Technical Conference on Actual Problems of Electronic Instrument Engineering, APEIE 2018 - Proceedings., 8545357, Institute of Electrical and Electronics Engineers Inc., pp. 132-135, 14th International Scientific-Technical Conference on Actual Problems of Electronic Instrument Engineering, APEIE 2018, Novosibirsk, Russian Federation, 2.10.18. https://doi.org/10.1109/APEIE.2018.8545357
Sivkov AA, Shanenkova YL, Polovinkina YN. Research of Method about the Application of the Copper Coating Deposition on the Surface Using the High-Speed Plasma Jet. In 2018 14th International Scientific-Technical Conference on Actual Problems of Electronic Instrument Engineering, APEIE 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2018. p. 132-135. 8545357 https://doi.org/10.1109/APEIE.2018.8545357
Sivkov, Alexander A. ; Shanenkova, Yuliya L. ; Polovinkina, Yuliya N. / Research of Method about the Application of the Copper Coating Deposition on the Surface Using the High-Speed Plasma Jet. 2018 14th International Scientific-Technical Conference on Actual Problems of Electronic Instrument Engineering, APEIE 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 132-135
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