Regimes of Spreading of a Water Droplet Over Substrates with Varying Wettability

G. V. Kuznetsov, D. V. Feoktistov, E. G. Orlova

Research output: Contribution to journalArticle

30 Citations (Scopus)

Abstract

The authors have presented the results of experimental investigations into the physical mechanisms of change in the dynamic angle of contact of a droplet of distilled water on a substrate under the conditions of its wetting at high velocities of motion of the three-phase contact line. The investigations were carried out on three copper substrates and one superhydrophobic substrate. The authors have singled out three regimes of spreading of the droplet on the copper substrates with different surface roughnesses: formation of a droplet, spreading of the droplet, and formation of an equilibrium angle of contact. A distinctive feature of the droplet spreading over the surface with a superhydrophobic coating has been revealed, which lies in the monotonic increase in the advancing dynamic contact angle. The influence of the volume rate of formation of a droplet on the value of the dynamic contact angle has been established. On the copper surfaces with roughnesses of 5.190 and 6.210 μm, increase in the rate tended to increase the maximum value of the contact inflow wetting angle. However, on the copper surface with a roughness of 0.591 μm, the dynamic contact angle was independent of the droplet′s volume in the range of volume rates of droplet growth 0.040–0.160 ml/s.

Original languageEnglish
Pages (from-to)317-322
Number of pages6
JournalJournal of Engineering Physics and Thermophysics
Volume89
Issue number2
DOIs
Publication statusPublished - 1 Mar 2016

Fingerprint

wettability
Wetting
Contact angle
Substrates
water
Water
copper
Copper
wetting
Surface roughness
roughness
surface roughness
coatings
Coatings

Keywords

  • dynamic contact angle
  • regimes of spreading
  • superhydrophobic coating
  • three-phase contact line
  • volume rate of formation of a droplet

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Engineering(all)

Cite this

Regimes of Spreading of a Water Droplet Over Substrates with Varying Wettability. / Kuznetsov, G. V.; Feoktistov, D. V.; Orlova, E. G.

In: Journal of Engineering Physics and Thermophysics, Vol. 89, No. 2, 01.03.2016, p. 317-322.

Research output: Contribution to journalArticle

@article{61f6dc3ef26940c991a61fede9cf381f,
title = "Regimes of Spreading of a Water Droplet Over Substrates with Varying Wettability",
abstract = "The authors have presented the results of experimental investigations into the physical mechanisms of change in the dynamic angle of contact of a droplet of distilled water on a substrate under the conditions of its wetting at high velocities of motion of the three-phase contact line. The investigations were carried out on three copper substrates and one superhydrophobic substrate. The authors have singled out three regimes of spreading of the droplet on the copper substrates with different surface roughnesses: formation of a droplet, spreading of the droplet, and formation of an equilibrium angle of contact. A distinctive feature of the droplet spreading over the surface with a superhydrophobic coating has been revealed, which lies in the monotonic increase in the advancing dynamic contact angle. The influence of the volume rate of formation of a droplet on the value of the dynamic contact angle has been established. On the copper surfaces with roughnesses of 5.190 and 6.210 μm, increase in the rate tended to increase the maximum value of the contact inflow wetting angle. However, on the copper surface with a roughness of 0.591 μm, the dynamic contact angle was independent of the droplet′s volume in the range of volume rates of droplet growth 0.040–0.160 ml/s.",
keywords = "dynamic contact angle, regimes of spreading, superhydrophobic coating, three-phase contact line, volume rate of formation of a droplet",
author = "Kuznetsov, {G. V.} and Feoktistov, {D. V.} and Orlova, {E. G.}",
year = "2016",
month = "3",
day = "1",
doi = "10.1007/s10891-016-1381-0",
language = "English",
volume = "89",
pages = "317--322",
journal = "Journal of Engineering Physics and Thermophysics",
issn = "1062-0125",
publisher = "Springer GmbH & Co, Auslieferungs-Gesellschaf",
number = "2",

}

TY - JOUR

T1 - Regimes of Spreading of a Water Droplet Over Substrates with Varying Wettability

AU - Kuznetsov, G. V.

AU - Feoktistov, D. V.

AU - Orlova, E. G.

PY - 2016/3/1

Y1 - 2016/3/1

N2 - The authors have presented the results of experimental investigations into the physical mechanisms of change in the dynamic angle of contact of a droplet of distilled water on a substrate under the conditions of its wetting at high velocities of motion of the three-phase contact line. The investigations were carried out on three copper substrates and one superhydrophobic substrate. The authors have singled out three regimes of spreading of the droplet on the copper substrates with different surface roughnesses: formation of a droplet, spreading of the droplet, and formation of an equilibrium angle of contact. A distinctive feature of the droplet spreading over the surface with a superhydrophobic coating has been revealed, which lies in the monotonic increase in the advancing dynamic contact angle. The influence of the volume rate of formation of a droplet on the value of the dynamic contact angle has been established. On the copper surfaces with roughnesses of 5.190 and 6.210 μm, increase in the rate tended to increase the maximum value of the contact inflow wetting angle. However, on the copper surface with a roughness of 0.591 μm, the dynamic contact angle was independent of the droplet′s volume in the range of volume rates of droplet growth 0.040–0.160 ml/s.

AB - The authors have presented the results of experimental investigations into the physical mechanisms of change in the dynamic angle of contact of a droplet of distilled water on a substrate under the conditions of its wetting at high velocities of motion of the three-phase contact line. The investigations were carried out on three copper substrates and one superhydrophobic substrate. The authors have singled out three regimes of spreading of the droplet on the copper substrates with different surface roughnesses: formation of a droplet, spreading of the droplet, and formation of an equilibrium angle of contact. A distinctive feature of the droplet spreading over the surface with a superhydrophobic coating has been revealed, which lies in the monotonic increase in the advancing dynamic contact angle. The influence of the volume rate of formation of a droplet on the value of the dynamic contact angle has been established. On the copper surfaces with roughnesses of 5.190 and 6.210 μm, increase in the rate tended to increase the maximum value of the contact inflow wetting angle. However, on the copper surface with a roughness of 0.591 μm, the dynamic contact angle was independent of the droplet′s volume in the range of volume rates of droplet growth 0.040–0.160 ml/s.

KW - dynamic contact angle

KW - regimes of spreading

KW - superhydrophobic coating

KW - three-phase contact line

KW - volume rate of formation of a droplet

UR - http://www.scopus.com/inward/record.url?scp=84962816227&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84962816227&partnerID=8YFLogxK

U2 - 10.1007/s10891-016-1381-0

DO - 10.1007/s10891-016-1381-0

M3 - Article

VL - 89

SP - 317

EP - 322

JO - Journal of Engineering Physics and Thermophysics

JF - Journal of Engineering Physics and Thermophysics

SN - 1062-0125

IS - 2

ER -