Raman based stress analysis of the active areas of a piezoresistive MEMS force sensor - Experimental setup, data processing, and comparison to numerically obtained results

P. Meszmer, K. Hiller, R. D. Rodriguez, E. Sheremet, D. R.T. Zahn, M. Hietschold, B. Wunderle

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

For the development of lifetime models in a physics-of-failure approach for microelectronic devices and functional elements on the submicron or even nanoscopic scale, the exact knowledge of the materials in use and their failure behavior is imperative. A piezoresistive MEMS force sensor, which can be integrated in MEMS sized tensile and fatigue test stages, was developed and is characterized using micro-Raman spectroscopy. This paper describes the experimental approach, the implementation and results of micro-Raman stress measurements in comparison to numerical simulations based on the finite element method.

Original languageEnglish
Title of host publication2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509021062
DOIs
Publication statusPublished - 29 Apr 2016
Externally publishedYes
Event17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 - Montpellier, France
Duration: 18 Apr 201620 Apr 2016

Conference

Conference17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
CountryFrance
CityMontpellier
Period18.4.1620.4.16

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Surfaces, Coatings and Films
  • Modelling and Simulation
  • Safety, Risk, Reliability and Quality
  • Industrial and Manufacturing Engineering

Cite this

Meszmer, P., Hiller, K., Rodriguez, R. D., Sheremet, E., Zahn, D. R. T., Hietschold, M., & Wunderle, B. (2016). Raman based stress analysis of the active areas of a piezoresistive MEMS force sensor - Experimental setup, data processing, and comparison to numerically obtained results. In 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 [7463340] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EuroSimE.2016.7463340