Abstract
The performance of pulsed magnetron sputtering was compared with dc magnetron in the deposition of Cu films. The pulsed magnetron discharge characteristics were investigated. The discharges were found to depend on the pulse length of the repetition frequency, the pulse power delivered to the magnetron, and the operating pressure.
| Original language | English |
|---|---|
| Pages (from-to) | 420-424 |
| Number of pages | 5 |
| Journal | Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films |
| Volume | 19 |
| Issue number | 2 |
| DOIs | |
| Publication status | Published - 1 Mar 2001 |
Fingerprint
ASJC Scopus subject areas
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films
Cite this
Musil, J., Leština, J., Vlček, J., & Tölg, T. (2001). Pulsed dc magnetron discharge for high-rate sputtering of thin films. Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films, 19(2), 420-424. https://doi.org/10.1116/1.1339018