The performance of pulsed magnetron sputtering was compared with dc magnetron in the deposition of Cu films. The pulsed magnetron discharge characteristics were investigated. The discharges were found to depend on the pulse length of the repetition frequency, the pulse power delivered to the magnetron, and the operating pressure.
|Number of pages||5|
|Journal||Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films|
|Publication status||Published - 1 Mar 2001|
ASJC Scopus subject areas
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films