Pulsed dc magnetron discharge for high-rate sputtering of thin films

J. Musil, J. Leština, J. Vlček, T. Tölg

Research output: Contribution to journalArticle

52 Citations (Scopus)

Abstract

The performance of pulsed magnetron sputtering was compared with dc magnetron in the deposition of Cu films. The pulsed magnetron discharge characteristics were investigated. The discharges were found to depend on the pulse length of the repetition frequency, the pulse power delivered to the magnetron, and the operating pressure.

Original languageEnglish
Pages (from-to)420-424
Number of pages5
JournalJournal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films
Volume19
Issue number2
DOIs
Publication statusPublished - 1 Mar 2001

Fingerprint

Magnetron sputtering
Sputtering
sputtering
Thin films
thin films
pulses
repetition
magnetron sputtering

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

Cite this

Pulsed dc magnetron discharge for high-rate sputtering of thin films. / Musil, J.; Leština, J.; Vlček, J.; Tölg, T.

In: Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films, Vol. 19, No. 2, 01.03.2001, p. 420-424.

Research output: Contribution to journalArticle

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