Abstract
The article reports on the effect of the addition of copper in the Al 2 O 3 film on its mechanical and optical properties. The Al-Cu-O films were reactively co-sputtered using DC pulse dual magnetron in a mixture of Ar + O 2 . One magnetron was equipped with a pure Al target and the second magnetron with a composed Al/Cu target. The amount of Al and Cu in the Al-Cu-O film was controlled by the length of pulse at the Al/Cu target. The Al-Cu-O films with ≤16 at.% Cu were investigated in detail. The addition of Cu in Al 2 O 3 film strongly influences its structure and mechanical properties. It is shown that (1) the structure of Al-Cu-O film gradually varies with increasing Cu content from γ-Al 2 O 3 at 0 at.% Cu through (Al 8-2x ,Cu 3x )O 12 nanocrystalline solid solution to CuAl 2 O 4 spinel structure, (2) the Al-Cu-O films with ≥3 at.% Cu exhibit (i) relatively high hardness H increasing from ∼15 GPa to ∼20 GPa, (ii) enhanced elastic recovery W e increasing from ∼67% to ∼76% with increasing Cu content from ∼5 to ∼16 at.% Cu and (iii) low values of Young's modulus E* satisfying the ratio H/E* > 0.1 at ≥5 at.% Cu, and (3) highly elastic Al-Cu-O films with H/E* > 0.1 exhibit enhanced resistance to cracking during indentation under high load.
| Original language | English |
|---|---|
| Pages (from-to) | 1762-1767 |
| Number of pages | 6 |
| Journal | Applied Surface Science |
| Volume | 258 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 15 Dec 2011 |
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Keywords
- Cu addition
- Elasticity
- Mechanical properties
- Pulse reactive sputtering
- Resistance to cracking
ASJC Scopus subject areas
- Surfaces, Coatings and Films
Cite this
Properties of nanocrystalline Al-Cu-O films reactively sputtered by DC pulse dual magnetron. / Blažek, J.; Musil, J.; Stupka, P.; Čerstvý, R.; Houška, J.
In: Applied Surface Science, Vol. 258, No. 5, 15.12.2011, p. 1762-1767.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Properties of nanocrystalline Al-Cu-O films reactively sputtered by DC pulse dual magnetron
AU - Blažek, J.
AU - Musil, J.
AU - Stupka, P.
AU - Čerstvý, R.
AU - Houška, J.
PY - 2011/12/15
Y1 - 2011/12/15
N2 - The article reports on the effect of the addition of copper in the Al 2 O 3 film on its mechanical and optical properties. The Al-Cu-O films were reactively co-sputtered using DC pulse dual magnetron in a mixture of Ar + O 2 . One magnetron was equipped with a pure Al target and the second magnetron with a composed Al/Cu target. The amount of Al and Cu in the Al-Cu-O film was controlled by the length of pulse at the Al/Cu target. The Al-Cu-O films with ≤16 at.% Cu were investigated in detail. The addition of Cu in Al 2 O 3 film strongly influences its structure and mechanical properties. It is shown that (1) the structure of Al-Cu-O film gradually varies with increasing Cu content from γ-Al 2 O 3 at 0 at.% Cu through (Al 8-2x ,Cu 3x )O 12 nanocrystalline solid solution to CuAl 2 O 4 spinel structure, (2) the Al-Cu-O films with ≥3 at.% Cu exhibit (i) relatively high hardness H increasing from ∼15 GPa to ∼20 GPa, (ii) enhanced elastic recovery W e increasing from ∼67% to ∼76% with increasing Cu content from ∼5 to ∼16 at.% Cu and (iii) low values of Young's modulus E* satisfying the ratio H/E* > 0.1 at ≥5 at.% Cu, and (3) highly elastic Al-Cu-O films with H/E* > 0.1 exhibit enhanced resistance to cracking during indentation under high load.
AB - The article reports on the effect of the addition of copper in the Al 2 O 3 film on its mechanical and optical properties. The Al-Cu-O films were reactively co-sputtered using DC pulse dual magnetron in a mixture of Ar + O 2 . One magnetron was equipped with a pure Al target and the second magnetron with a composed Al/Cu target. The amount of Al and Cu in the Al-Cu-O film was controlled by the length of pulse at the Al/Cu target. The Al-Cu-O films with ≤16 at.% Cu were investigated in detail. The addition of Cu in Al 2 O 3 film strongly influences its structure and mechanical properties. It is shown that (1) the structure of Al-Cu-O film gradually varies with increasing Cu content from γ-Al 2 O 3 at 0 at.% Cu through (Al 8-2x ,Cu 3x )O 12 nanocrystalline solid solution to CuAl 2 O 4 spinel structure, (2) the Al-Cu-O films with ≥3 at.% Cu exhibit (i) relatively high hardness H increasing from ∼15 GPa to ∼20 GPa, (ii) enhanced elastic recovery W e increasing from ∼67% to ∼76% with increasing Cu content from ∼5 to ∼16 at.% Cu and (iii) low values of Young's modulus E* satisfying the ratio H/E* > 0.1 at ≥5 at.% Cu, and (3) highly elastic Al-Cu-O films with H/E* > 0.1 exhibit enhanced resistance to cracking during indentation under high load.
KW - Cu addition
KW - Elasticity
KW - Mechanical properties
KW - Pulse reactive sputtering
KW - Resistance to cracking
UR - http://www.scopus.com/inward/record.url?scp=81555200098&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=81555200098&partnerID=8YFLogxK
U2 - 10.1016/j.apsusc.2011.10.039
DO - 10.1016/j.apsusc.2011.10.039
M3 - Article
VL - 258
SP - 1762
EP - 1767
JO - Applied Surface Science
JF - Applied Surface Science
SN - 0169-4332
IS - 5
ER -