Translated title of the contribution: Programmable switching area

Alexey Ivanovich Soldatov, Anzhela Yurevna Matrosova, Oleg Honbinovich Kim, Andrey Alexeevich Soldatov, Mariya Alexeevna Kostina

Research output: Contribution to journalArticlepeer-review


Currently, there is a long-term movement to increase the level of integration of the electronic component base. Another major trend in modern microelectronics is the development of 3D integration chip technologies. 3D-TSV technology for the production of 3D integration chips is recognized as key by the absolute majority of leading foreign and Russian experts. The main problems in 3D-TSV technology are related to the implementation of a large number of internal connections and the need to ensure stable operation of the electrical circuit in a multilayer structure. Increasing the number of stackable chips leads to an increase in the number of TSV connections, which leads to increase in physical size "stackable" chips, and physical dimensions of a 3D-TSV chip. The second most popular technology of 3D chip is SiP technology. The main disadvantages of SiP technology are associated with the increase in the length of the external pins of the chip, as the number of integrated chips increases. In addition to these disadvantages there is another important problem is a large number of pins of chips. According to the authors, the main source of problems in the existing modern microelectronics technologies is the principle of joint arrangement of electronic components and electrical conductors on a "rigid structure". The authors propose the concept of building of a multidimensional programmable switching area (PSA), which has a conflict-free, reduced total number of switches compared to a conventional matrix switch, all performed electrical connections contain the same number of switches equal to 4. Significantly reducing the number of switches in PSA without reducing its functionality allows you to reduce the size of the chip, increase reliability and reduce power consumption. As the dimension of the matrix switch increases, the benefit in the number of switches increases. The total number of switches in the PSA containing N connecting pins is equal to С1 = 2 • √n3 = 2 N3 . The total number of switches in a cross-bar containing N connection pins is equal to С2 = N2. The reduction in the number of switches in the PSA compared to a cross-bar, will be C= C2/C1/ N2/2 • (√N)3 -√N/2. The use of the proposed PCC allows you to create 3D-chips of high integration, while different types of chips can be connected to the pins of the PSA: microprocessors, RAM, ROM, FPGA and other electronic components, and external the pins will only output the necessary signals that will reduce the number of pins of the chip. All connections in accordance with the implemented electrical circuit are performed by programming the PSA. The proposed approach will allow to create unified basic technologies and designs of 3D integration chips, providing simplification of technological and algorithmic problems.

Translated title of the contributionProgrammable switching area
Original languageRussian
Pages (from-to)114-122
Number of pages9
JournalVestnik Tomskogo Gosudarstvennogo Universiteta - Upravlenie, Vychislitel'naya Tekhnika i Informatika
Issue number50
Publication statusPublished - 2020

ASJC Scopus subject areas

  • Computer Science Applications
  • Information Systems
  • Computer Networks and Communications

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