Process development for laser powder bed fusion of pure copper

Thomas Stoll, Pascal Trautnitz, Samuel Schmiedeke, Joerg Franke, Nahum Travitzky

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper describes the development of suitable process parameters to ensure a reproducible, defect-free production of pure copper specimen via Laser Powder Bed Fusion (LPBF) also called Selective Laser Melting (SLM). Therefore, a set of experiments was developed and evaluated in a Design of Experiment (DoE) which finally provide an indication about ideal process parameters for melting pure copper powder at a wavelength of 1064 nm. For the experiments Cu-ETP with a copper purity of more than 99.90 % was processed with a laser power of up to 500 W resulting in a maximum density of 99.82 % and an electrical conductivity of 56.88 MS/m. Besides the development of optimal parameter combinations of laser power, laser speed and hatching distance, focusing the laser beam to a spot diameter of about 35 μm with a fused silica f-theta lens and thus high energy intensities of about 416 kW/mm2 resulted in best materials properties.

Original languageEnglish
Title of host publicationLaser 3D Manufacturing VII
EditorsBo Gu, Hongqiang Chen, Henry Helvajian
PublisherSPIE
ISBN (Electronic)9781510633056
DOIs
Publication statusPublished - 2020
EventLaser 3D Manufacturing VII 2020 - San Francisco, United States
Duration: 4 Feb 20206 Feb 2020

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume11271
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceLaser 3D Manufacturing VII 2020
CountryUnited States
CitySan Francisco
Period4.2.206.2.20

Keywords

  • Additive Manufacturing
  • Copper
  • Electrical conductivity
  • Laser Powder Bed Fusion
  • Selective Laser Melting

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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