Abstract
For properties characterization of nanostructured materials and simultaneously to predict their reliability a tensile testing system consisting of a thermal actuator and a lateral nano-Newton force piezoresistive sensor is presented. The implementation of a piezoresistive load sensor in a MEMS-based tensile testing system can be regarded as an innovative and ultrasensitive method to continuously observe the specimen deformation while simultaneously measuring the applied load electronically with nano-Newton resolution. The primary technique that we have used for the fabrication of these systems is Bonding and Deep Reactive Ion Etching (BDRIE) applied on SOI wafers.
| Original language | English |
|---|---|
| Title of host publication | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 |
| DOIs | |
| Publication status | Published - 7 Aug 2013 |
| Externally published | Yes |
| Event | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 - Wroclaw, Poland Duration: 14 Apr 2013 → 17 Apr 2013 |
Conference
| Conference | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 |
|---|---|
| Country | Poland |
| City | Wroclaw |
| Period | 14.4.13 → 17.4.13 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Modelling and Simulation
Cite this
Piezoresistive force sensor and thermal actuators usage as applications to nanosystems manipulation : Design, simulations, technology and experiments. / Schondelmaier, Gianina; Hartmann, Steffen; May, Daniel; Shaporin, Alexey; Voigt, Sebastian; Rodriguez, R. D.; Gordan, O. D.; Zahn, D. R.T.; Mehner, Jan; Hiller, Karla; Wunderle, Bernhard.
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 2013. 6529967.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Piezoresistive force sensor and thermal actuators usage as applications to nanosystems manipulation
T2 - Design, simulations, technology and experiments
AU - Schondelmaier, Gianina
AU - Hartmann, Steffen
AU - May, Daniel
AU - Shaporin, Alexey
AU - Voigt, Sebastian
AU - Rodriguez, R. D.
AU - Gordan, O. D.
AU - Zahn, D. R.T.
AU - Mehner, Jan
AU - Hiller, Karla
AU - Wunderle, Bernhard
PY - 2013/8/7
Y1 - 2013/8/7
N2 - For properties characterization of nanostructured materials and simultaneously to predict their reliability a tensile testing system consisting of a thermal actuator and a lateral nano-Newton force piezoresistive sensor is presented. The implementation of a piezoresistive load sensor in a MEMS-based tensile testing system can be regarded as an innovative and ultrasensitive method to continuously observe the specimen deformation while simultaneously measuring the applied load electronically with nano-Newton resolution. The primary technique that we have used for the fabrication of these systems is Bonding and Deep Reactive Ion Etching (BDRIE) applied on SOI wafers.
AB - For properties characterization of nanostructured materials and simultaneously to predict their reliability a tensile testing system consisting of a thermal actuator and a lateral nano-Newton force piezoresistive sensor is presented. The implementation of a piezoresistive load sensor in a MEMS-based tensile testing system can be regarded as an innovative and ultrasensitive method to continuously observe the specimen deformation while simultaneously measuring the applied load electronically with nano-Newton resolution. The primary technique that we have used for the fabrication of these systems is Bonding and Deep Reactive Ion Etching (BDRIE) applied on SOI wafers.
UR - http://www.scopus.com/inward/record.url?scp=84880972241&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84880972241&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE.2013.6529967
DO - 10.1109/EuroSimE.2013.6529967
M3 - Conference contribution
AN - SCOPUS:84880972241
SN - 9781467361385
BT - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
ER -