Piezoresistive force sensor and thermal actuators usage as applications to nanosystems manipulation: Design, simulations, technology and experiments

Abstract

For properties characterization of nanostructured materials and simultaneously to predict their reliability a tensile testing system consisting of a thermal actuator and a lateral nano-Newton force piezoresistive sensor is presented. The implementation of a piezoresistive load sensor in a MEMS-based tensile testing system can be regarded as an innovative and ultrasensitive method to continuously observe the specimen deformation while simultaneously measuring the applied load electronically with nano-Newton resolution. The primary technique that we have used for the fabrication of these systems is Bonding and Deep Reactive Ion Etching (BDRIE) applied on SOI wafers.

Original language	English
Title of host publication	2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
DOIs	https://doi.org/10.1109/EuroSimE.2013.6529967
Publication status	Published - 7 Aug 2013
Externally published	Yes
Event	2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 - Wroclaw, Poland Duration: 14 Apr 2013 → 17 Apr 2013

Conference

Conference	2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
Country	Poland
City	Wroclaw
Period	14.4.13 → 17.4.13

ASJC Scopus subject areas

Electrical and Electronic Engineering
Modelling and Simulation

Access to Document

10.1109/EuroSimE.2013.6529967

Fingerprint Dive into the research topics of 'Piezoresistive force sensor and thermal actuators usage as applications to nanosystems manipulation: Design, simulations, technology and experiments'. Together they form a unique fingerprint.

Cite this

Schondelmaier, G., Hartmann, S., May, D., Shaporin, A., Voigt, S., Rodriguez, R. D., Gordan, O. D., Zahn, D. R. T., Mehner, J., Hiller, K., & Wunderle, B. (2013). Piezoresistive force sensor and thermal actuators usage as applications to nanosystems manipulation: Design, simulations, technology and experiments. In 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 [6529967] https://doi.org/10.1109/EuroSimE.2013.6529967

Piezoresistive force sensor and thermal actuators usage as applications to nanosystems manipulation : Design, simulations, technology and experiments. / Schondelmaier, Gianina; Hartmann, Steffen; May, Daniel; Shaporin, Alexey; Voigt, Sebastian; Rodriguez, R. D.; Gordan, O. D.; Zahn, D. R.T.; Mehner, Jan; Hiller, Karla; Wunderle, Bernhard.

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 2013. 6529967.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Schondelmaier, G, Hartmann, S, May, D, Shaporin, A, Voigt, S, Rodriguez, RD, Gordan, OD, Zahn, DRT, Mehner, J, Hiller, K & Wunderle, B 2013, Piezoresistive force sensor and thermal actuators usage as applications to nanosystems manipulation: Design, simulations, technology and experiments. in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013., 6529967, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013, Wroclaw, Poland, 14.4.13. https://doi.org/10.1109/EuroSimE.2013.6529967

Schondelmaier G, Hartmann S, May D, Shaporin A, Voigt S, Rodriguez RD et al. Piezoresistive force sensor and thermal actuators usage as applications to nanosystems manipulation: Design, simulations, technology and experiments. In 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 2013. 6529967 https://doi.org/10.1109/EuroSimE.2013.6529967

Schondelmaier, Gianina ; Hartmann, Steffen ; May, Daniel ; Shaporin, Alexey ; Voigt, Sebastian ; Rodriguez, R. D. ; Gordan, O. D. ; Zahn, D. R.T. ; Mehner, Jan ; Hiller, Karla ; Wunderle, Bernhard. / Piezoresistive force sensor and thermal actuators usage as applications to nanosystems manipulation : Design, simulations, technology and experiments. 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 2013.

@inproceedings{8f7245e70a214552a1a8d459acbd52bc,

title = "Piezoresistive force sensor and thermal actuators usage as applications to nanosystems manipulation: Design, simulations, technology and experiments",

abstract = "For properties characterization of nanostructured materials and simultaneously to predict their reliability a tensile testing system consisting of a thermal actuator and a lateral nano-Newton force piezoresistive sensor is presented. The implementation of a piezoresistive load sensor in a MEMS-based tensile testing system can be regarded as an innovative and ultrasensitive method to continuously observe the specimen deformation while simultaneously measuring the applied load electronically with nano-Newton resolution. The primary technique that we have used for the fabrication of these systems is Bonding and Deep Reactive Ion Etching (BDRIE) applied on SOI wafers.",

author = "Gianina Schondelmaier and Steffen Hartmann and Daniel May and Alexey Shaporin and Sebastian Voigt and Rodriguez, {R. D.} and Gordan, {O. D.} and Zahn, {D. R.T.} and Jan Mehner and Karla Hiller and Bernhard Wunderle",

year = "2013",

month = aug,

day = "7",

doi = "10.1109/EuroSimE.2013.6529967",

language = "English",

isbn = "9781467361385",

booktitle = "2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013",

note = "2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 ; Conference date: 14-04-2013 Through 17-04-2013",

}

TY - GEN

T1 - Piezoresistive force sensor and thermal actuators usage as applications to nanosystems manipulation

T2 - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013

AU - Schondelmaier, Gianina

AU - Hartmann, Steffen

AU - May, Daniel

AU - Shaporin, Alexey

AU - Voigt, Sebastian

AU - Rodriguez, R. D.

AU - Gordan, O. D.

AU - Zahn, D. R.T.

AU - Mehner, Jan

AU - Hiller, Karla

AU - Wunderle, Bernhard

PY - 2013/8/7

Y1 - 2013/8/7

N2 - For properties characterization of nanostructured materials and simultaneously to predict their reliability a tensile testing system consisting of a thermal actuator and a lateral nano-Newton force piezoresistive sensor is presented. The implementation of a piezoresistive load sensor in a MEMS-based tensile testing system can be regarded as an innovative and ultrasensitive method to continuously observe the specimen deformation while simultaneously measuring the applied load electronically with nano-Newton resolution. The primary technique that we have used for the fabrication of these systems is Bonding and Deep Reactive Ion Etching (BDRIE) applied on SOI wafers.

AB - For properties characterization of nanostructured materials and simultaneously to predict their reliability a tensile testing system consisting of a thermal actuator and a lateral nano-Newton force piezoresistive sensor is presented. The implementation of a piezoresistive load sensor in a MEMS-based tensile testing system can be regarded as an innovative and ultrasensitive method to continuously observe the specimen deformation while simultaneously measuring the applied load electronically with nano-Newton resolution. The primary technique that we have used for the fabrication of these systems is Bonding and Deep Reactive Ion Etching (BDRIE) applied on SOI wafers.

UR - http://www.scopus.com/inward/record.url?scp=84880972241&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84880972241&partnerID=8YFLogxK

U2 - 10.1109/EuroSimE.2013.6529967

DO - 10.1109/EuroSimE.2013.6529967

M3 - Conference contribution

AN - SCOPUS:84880972241

SN - 9781467361385

BT - 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013

Y2 - 14 April 2013 through 17 April 2013