Abstract
For properties characterization of nanostructured materials and simultaneously to predict their reliability a tensile testing system consisting of a thermal actuator and a lateral nano-Newton force piezoresistive sensor is presented. The implementation of a piezoresistive load sensor in a MEMS-based tensile testing system can be regarded as an innovative and ultrasensitive method to continuously observe the specimen deformation while simultaneously measuring the applied load electronically with nano-Newton resolution. The primary technique that we have used for the fabrication of these systems is Bonding and Deep Reactive Ion Etching (BDRIE) applied on SOI wafers.
Original language | English |
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Title of host publication | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 |
DOIs | |
Publication status | Published - 7 Aug 2013 |
Externally published | Yes |
Event | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 - Wroclaw, Poland Duration: 14 Apr 2013 → 17 Apr 2013 |
Conference
Conference | 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 |
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Country | Poland |
City | Wroclaw |
Period | 14.4.13 → 17.4.13 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Modelling and Simulation