Abstract
We obtained the contact pair copper-aluminum copper coating by using a magneto plasma accelerator. The process is realized during supersonic copper plasma jet flowing into the chamber filled with the air atmosphere. Copper jet is carried out of the accelerating channel towards the aluminum target. Plasma jet is generated by coaxial magnetoplasma accelerator (CMPA) based on copper electrode system. The CMPA is supplied from the pulsed capacitive energy storage with the maximum value of stored energy of 360 kJ. The obtained copper-aluminum contact pairs have been analyzed by X-ray diffractometry and Nano hardness tester. The copper coating on the aluminum surface is uniform with thickness about 100 gm. Also in this paper it is shown that transitional contact resistance of copper-aluminum contact pair is at 2,5 times less than a direct connection of copper and aluminum (test contact pair).
| Original language | English |
|---|---|
| Title of host publication | IOP Conference Series: Materials Science and Engineering |
| Publisher | Institute of Physics Publishing |
| Volume | 66 |
| Edition | 1 |
| DOIs | |
| Publication status | Published - 2014 |
| Event | 20th International Conference for Students and Young Scientists: Modern Techniques and Technologies, MTT 2014 - Tomsk, Russian Federation Duration: 14 Apr 2014 → 18 Apr 2014 |
Other
| Other | 20th International Conference for Students and Young Scientists: Modern Techniques and Technologies, MTT 2014 |
|---|---|
| Country | Russian Federation |
| City | Tomsk |
| Period | 14.4.14 → 18.4.14 |
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ASJC Scopus subject areas
- Engineering(all)
- Materials Science(all)
Cite this
Phase analysis study of the copper-aluminum contact pair obtained by plasma dynamic method. / Sivkov, A.; Saygash, A.; Kolganova, J.; Shanenkov, I.
IOP Conference Series: Materials Science and Engineering. Vol. 66 1. ed. Institute of Physics Publishing, 2014. 012048.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Phase analysis study of the copper-aluminum contact pair obtained by plasma dynamic method
AU - Sivkov, A.
AU - Saygash, A.
AU - Kolganova, J.
AU - Shanenkov, I.
PY - 2014
Y1 - 2014
N2 - We obtained the contact pair copper-aluminum copper coating by using a magneto plasma accelerator. The process is realized during supersonic copper plasma jet flowing into the chamber filled with the air atmosphere. Copper jet is carried out of the accelerating channel towards the aluminum target. Plasma jet is generated by coaxial magnetoplasma accelerator (CMPA) based on copper electrode system. The CMPA is supplied from the pulsed capacitive energy storage with the maximum value of stored energy of 360 kJ. The obtained copper-aluminum contact pairs have been analyzed by X-ray diffractometry and Nano hardness tester. The copper coating on the aluminum surface is uniform with thickness about 100 gm. Also in this paper it is shown that transitional contact resistance of copper-aluminum contact pair is at 2,5 times less than a direct connection of copper and aluminum (test contact pair).
AB - We obtained the contact pair copper-aluminum copper coating by using a magneto plasma accelerator. The process is realized during supersonic copper plasma jet flowing into the chamber filled with the air atmosphere. Copper jet is carried out of the accelerating channel towards the aluminum target. Plasma jet is generated by coaxial magnetoplasma accelerator (CMPA) based on copper electrode system. The CMPA is supplied from the pulsed capacitive energy storage with the maximum value of stored energy of 360 kJ. The obtained copper-aluminum contact pairs have been analyzed by X-ray diffractometry and Nano hardness tester. The copper coating on the aluminum surface is uniform with thickness about 100 gm. Also in this paper it is shown that transitional contact resistance of copper-aluminum contact pair is at 2,5 times less than a direct connection of copper and aluminum (test contact pair).
UR - http://www.scopus.com/inward/record.url?scp=84907803240&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84907803240&partnerID=8YFLogxK
U2 - 10.1088/1757-899X/66/1/012048
DO - 10.1088/1757-899X/66/1/012048
M3 - Conference contribution
VL - 66
BT - IOP Conference Series: Materials Science and Engineering
PB - Institute of Physics Publishing
ER -