Phase analysis study of the copper-aluminum contact pair obtained by plasma dynamic method

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

We obtained the contact pair copper-aluminum copper coating by using a magneto plasma accelerator. The process is realized during supersonic copper plasma jet flowing into the chamber filled with the air atmosphere. Copper jet is carried out of the accelerating channel towards the aluminum target. Plasma jet is generated by coaxial magnetoplasma accelerator (CMPA) based on copper electrode system. The CMPA is supplied from the pulsed capacitive energy storage with the maximum value of stored energy of 360 kJ. The obtained copper-aluminum contact pairs have been analyzed by X-ray diffractometry and Nano hardness tester. The copper coating on the aluminum surface is uniform with thickness about 100 gm. Also in this paper it is shown that transitional contact resistance of copper-aluminum contact pair is at 2,5 times less than a direct connection of copper and aluminum (test contact pair).

Original languageEnglish
Title of host publicationIOP Conference Series: Materials Science and Engineering
PublisherInstitute of Physics Publishing
Volume66
Edition1
DOIs
Publication statusPublished - 2014
Event20th International Conference for Students and Young Scientists: Modern Techniques and Technologies, MTT 2014 - Tomsk, Russian Federation
Duration: 14 Apr 201418 Apr 2014

Other

Other20th International Conference for Students and Young Scientists: Modern Techniques and Technologies, MTT 2014
CountryRussian Federation
CityTomsk
Period14.4.1418.4.14

Fingerprint

Aluminum
Copper
Plasmas
Magnetoplasma
Plasma jets
Particle accelerators
Plasma accelerators
Nanohardness
Coatings
Contact resistance
Energy storage
X ray diffraction analysis
Electrodes
Air

ASJC Scopus subject areas

  • Engineering(all)
  • Materials Science(all)

Cite this

Sivkov, A., Saygash, A., Kolganova, J., & Shanenkov, I. (2014). Phase analysis study of the copper-aluminum contact pair obtained by plasma dynamic method. In IOP Conference Series: Materials Science and Engineering (1 ed., Vol. 66). [012048] Institute of Physics Publishing. https://doi.org/10.1088/1757-899X/66/1/012048

Phase analysis study of the copper-aluminum contact pair obtained by plasma dynamic method. / Sivkov, A.; Saygash, A.; Kolganova, J.; Shanenkov, I.

IOP Conference Series: Materials Science and Engineering. Vol. 66 1. ed. Institute of Physics Publishing, 2014. 012048.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sivkov, A, Saygash, A, Kolganova, J & Shanenkov, I 2014, Phase analysis study of the copper-aluminum contact pair obtained by plasma dynamic method. in IOP Conference Series: Materials Science and Engineering. 1 edn, vol. 66, 012048, Institute of Physics Publishing, 20th International Conference for Students and Young Scientists: Modern Techniques and Technologies, MTT 2014, Tomsk, Russian Federation, 14.4.14. https://doi.org/10.1088/1757-899X/66/1/012048
Sivkov A, Saygash A, Kolganova J, Shanenkov I. Phase analysis study of the copper-aluminum contact pair obtained by plasma dynamic method. In IOP Conference Series: Materials Science and Engineering. 1 ed. Vol. 66. Institute of Physics Publishing. 2014. 012048 https://doi.org/10.1088/1757-899X/66/1/012048
Sivkov, A. ; Saygash, A. ; Kolganova, J. ; Shanenkov, I. / Phase analysis study of the copper-aluminum contact pair obtained by plasma dynamic method. IOP Conference Series: Materials Science and Engineering. Vol. 66 1. ed. Institute of Physics Publishing, 2014.
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