TY - GEN
T1 - Pcb-embedding of power dies using pressed metal foam
AU - Pascal, Yoann
AU - Labrousse, Denis
AU - Petit, Mickaël
AU - Lefebvre, Stéphane
AU - Costa, François
PY - 2018/1/1
Y1 - 2018/1/1
N2 - This paper presents a new technique to manufacture the top-side contact of a PCB-embedded power die, using a pressed piece of tmetal foam. The manufacturing process is tdetailed, prototypes are manufactured and electrically characterized, and the technique is tused to embed a switching cell with a 1.7 nH switching loop. This process is easy to make and highly cost-effective; the electric resistance of the assembly is close to that of a state-of-the-art industrial package using bond wires, moreover the stray inductance is minimized.
AB - This paper presents a new technique to manufacture the top-side contact of a PCB-embedded power die, using a pressed piece of tmetal foam. The manufacturing process is tdetailed, prototypes are manufactured and electrically characterized, and the technique is tused to embed a switching cell with a 1.7 nH switching loop. This process is easy to make and highly cost-effective; the electric resistance of the assembly is close to that of a state-of-the-art industrial package using bond wires, moreover the stray inductance is minimized.
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M3 - Conference contribution
AN - SCOPUS:85054812756
SN - 9783800746460
T3 - PCIM Europe Conference Proceedings
SP - 1451
EP - 1438
BT - PCIM Europe Conference Proceedings
A2 - Scharf, Achim
PB - Mesago PCIM GmbH
T2 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018
Y2 - 5 June 2018 through 7 June 2018
ER -