Pcb-embedding of power dies using pressed metal foam

Yoann Pascal, Denis Labrousse, Mickaël Petit, Stéphane Lefebvre, François Costa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper presents a new technique to manufacture the top-side contact of a PCB-embedded power die, using a pressed piece of tmetal foam. The manufacturing process is tdetailed, prototypes are manufactured and electrically characterized, and the technique is tused to embed a switching cell with a 1.7 nH switching loop. This process is easy to make and highly cost-effective; the electric resistance of the assembly is close to that of a state-of-the-art industrial package using bond wires, moreover the stray inductance is minimized.

Original languageEnglish
Title of host publicationPCIM Europe Conference Proceedings
EditorsAchim Scharf
PublisherMesago PCIM GmbH
Pages1451-1438
Number of pages14
Edition225809
ISBN (Print)9783800746460
Publication statusPublished - 1 Jan 2018
Externally publishedYes
EventInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018 - Nuremberg, Germany
Duration: 5 Jun 20187 Jun 2018

Publication series

NamePCIM Europe Conference Proceedings
Number225809
ISSN (Electronic)2191-3358

Conference

ConferenceInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018
CountryGermany
CityNuremberg
Period5.6.187.6.18

Fingerprint

Foams
Metals
Polychlorinated biphenyls
Inductance
Wire
Costs

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Pascal, Y., Labrousse, D., Petit, M., Lefebvre, S., & Costa, F. (2018). Pcb-embedding of power dies using pressed metal foam. In A. Scharf (Ed.), PCIM Europe Conference Proceedings (225809 ed., pp. 1451-1438). (PCIM Europe Conference Proceedings; No. 225809). Mesago PCIM GmbH.

Pcb-embedding of power dies using pressed metal foam. / Pascal, Yoann; Labrousse, Denis; Petit, Mickaël; Lefebvre, Stéphane; Costa, François.

PCIM Europe Conference Proceedings. ed. / Achim Scharf. 225809. ed. Mesago PCIM GmbH, 2018. p. 1451-1438 (PCIM Europe Conference Proceedings; No. 225809).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Pascal, Y, Labrousse, D, Petit, M, Lefebvre, S & Costa, F 2018, Pcb-embedding of power dies using pressed metal foam. in A Scharf (ed.), PCIM Europe Conference Proceedings. 225809 edn, PCIM Europe Conference Proceedings, no. 225809, Mesago PCIM GmbH, pp. 1451-1438, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018, Nuremberg, Germany, 5.6.18.
Pascal Y, Labrousse D, Petit M, Lefebvre S, Costa F. Pcb-embedding of power dies using pressed metal foam. In Scharf A, editor, PCIM Europe Conference Proceedings. 225809 ed. Mesago PCIM GmbH. 2018. p. 1451-1438. (PCIM Europe Conference Proceedings; 225809).
Pascal, Yoann ; Labrousse, Denis ; Petit, Mickaël ; Lefebvre, Stéphane ; Costa, François. / Pcb-embedding of power dies using pressed metal foam. PCIM Europe Conference Proceedings. editor / Achim Scharf. 225809. ed. Mesago PCIM GmbH, 2018. pp. 1451-1438 (PCIM Europe Conference Proceedings; 225809).
@inproceedings{d3fdcef2f8334afdb56f721418e2a48d,
title = "Pcb-embedding of power dies using pressed metal foam",
abstract = "This paper presents a new technique to manufacture the top-side contact of a PCB-embedded power die, using a pressed piece of tmetal foam. The manufacturing process is tdetailed, prototypes are manufactured and electrically characterized, and the technique is tused to embed a switching cell with a 1.7 nH switching loop. This process is easy to make and highly cost-effective; the electric resistance of the assembly is close to that of a state-of-the-art industrial package using bond wires, moreover the stray inductance is minimized.",
author = "Yoann Pascal and Denis Labrousse and Micka{\"e}l Petit and St{\'e}phane Lefebvre and Fran{\cc}ois Costa",
year = "2018",
month = "1",
day = "1",
language = "English",
isbn = "9783800746460",
series = "PCIM Europe Conference Proceedings",
publisher = "Mesago PCIM GmbH",
number = "225809",
pages = "1451--1438",
editor = "Achim Scharf",
booktitle = "PCIM Europe Conference Proceedings",
edition = "225809",

}

TY - GEN

T1 - Pcb-embedding of power dies using pressed metal foam

AU - Pascal, Yoann

AU - Labrousse, Denis

AU - Petit, Mickaël

AU - Lefebvre, Stéphane

AU - Costa, François

PY - 2018/1/1

Y1 - 2018/1/1

N2 - This paper presents a new technique to manufacture the top-side contact of a PCB-embedded power die, using a pressed piece of tmetal foam. The manufacturing process is tdetailed, prototypes are manufactured and electrically characterized, and the technique is tused to embed a switching cell with a 1.7 nH switching loop. This process is easy to make and highly cost-effective; the electric resistance of the assembly is close to that of a state-of-the-art industrial package using bond wires, moreover the stray inductance is minimized.

AB - This paper presents a new technique to manufacture the top-side contact of a PCB-embedded power die, using a pressed piece of tmetal foam. The manufacturing process is tdetailed, prototypes are manufactured and electrically characterized, and the technique is tused to embed a switching cell with a 1.7 nH switching loop. This process is easy to make and highly cost-effective; the electric resistance of the assembly is close to that of a state-of-the-art industrial package using bond wires, moreover the stray inductance is minimized.

UR - http://www.scopus.com/inward/record.url?scp=85054812756&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85054812756&partnerID=8YFLogxK

M3 - Conference contribution

SN - 9783800746460

T3 - PCIM Europe Conference Proceedings

SP - 1451

EP - 1438

BT - PCIM Europe Conference Proceedings

A2 - Scharf, Achim

PB - Mesago PCIM GmbH

ER -