Optimizing components and evaluating technical performance of IR thermographic NDT systems

Abstract

A typical infrared (IR) thermographic system intended for active thermal/IR nondestructive testing includes a heat source, an IR imager and a computer. The software ensures acquisition and processing of IR image sequences to result in a binary map of defects or other image which is to be interpreted by a thermographer in order to meet inspection requirements. Typically, hardware developers supply a certain set of technical parameters of their units, such as heater power, imager temperature resolution, acquisition rate and a set of available data processing algorithms. The suggested approach allows optimization of inspection parameters if thermal and optical parameters of test materials are known.

Original language	English
Title of host publication	Thermosense: Thermal Infrared Applications XXXVIII
Publisher	SPIE
Volume	9861
ISBN (Electronic)	9781510601024
DOIs	https://doi.org/10.1117/12.2222981
Publication status	Published - 2016
Event	Thermosense: Thermal Infrared Applications XXXVIII - Baltimore, United States Duration: 18 Apr 2016 → 21 Apr 2016

Conference

Conference	Thermosense: Thermal Infrared Applications XXXVIII
Country	United States
City	Baltimore
Period	18.4.16 → 21.4.16

Keywords

active thermal testing
composite
heat source
Infrared thermography
reference sample

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Electrical and Electronic Engineering
Applied Mathematics

Access to Document

10.1117/12.2222981

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Activities

1 Participation in conference

Thermosense: Thermal Infrared Applications-XXXVIII

Vladimir Platonovich Vavilov (Participant)

18 Apr 2016 → 22 Apr 2016

Activity: Participating in or organising an event types › Participation in conference

Cite this

Chulkov, A. O., Vavilov, V. P., & Pawar, S. S. (2016). Optimizing components and evaluating technical performance of IR thermographic NDT systems. In Thermosense: Thermal Infrared Applications XXXVIII (Vol. 9861). [98610M] SPIE. https://doi.org/10.1117/12.2222981

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