Numerical study of plasmonic nanostructures based on Au-Ag Alloy

Vladimir A. Kolchuzhin, Jan E. Mehner, Evgeniya Sheremet, Raul D. Rodriguez, Dietrich R T Zahn

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The important aspects in modeling of plasmonics structures, the parameters necessary in creating models are presented and discussed. Our simulation results show that by combining two spherical particles of different materials (Au and Ag) and their alloys, the electric field enhancement can be tuned in the visible range. The implementing of multiphysics issues in the modeling of plasmonics structures, considering heating due to field absorption, and calculation of the optical forces are the part of future work.

Original languageEnglish
Title of host publicationSmart Systems Integration 2015 - 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems
Subtitle of host publicationMEMS, NEMS, ICs and Electronic Components, SSI 2015
PublisherApprimus Verlag
Pages414-417
Number of pages4
ISBN (Electronic)9783863592967
Publication statusPublished - 1 Jan 2015
Externally publishedYes
EventSmart Systems Integration 2015 - 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, NEMS, ICs and Electronic Components, SSI 2015 - Copenhagen, Denmark
Duration: 11 Mar 201512 Mar 2015

Conference

ConferenceSmart Systems Integration 2015 - 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, NEMS, ICs and Electronic Components, SSI 2015
CountryDenmark
CityCopenhagen
Period11.3.1512.3.15

ASJC Scopus subject areas

  • Computer Science Applications
  • Computer Networks and Communications
  • Artificial Intelligence

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  • Cite this

    Kolchuzhin, V. A., Mehner, J. E., Sheremet, E., Rodriguez, R. D., & Zahn, D. R. T. (2015). Numerical study of plasmonic nanostructures based on Au-Ag Alloy. In Smart Systems Integration 2015 - 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems: MEMS, NEMS, ICs and Electronic Components, SSI 2015 (pp. 414-417). Apprimus Verlag.