Numerical estimation of errors of temperature measurements by thermocouples using special glues and pastes

G. V. Kuznetsov, K. M. Mukhammadeev

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

Results of numerical modeling the temperature fields in a thermocouple junction with an ideal junction-material contact and with a gap filled with a special glue (or paste) near any boundary of the junction are presented. The influence of the conditions of the thermocouple-material surface contact on the temperature measurement error is estimated.

Original languageEnglish
Pages (from-to)17-22
Number of pages6
JournalJournal of Engineering Thermophysics
Volume19
Issue number1
DOIs
Publication statusPublished - Mar 2010

Fingerprint

Adhesive pastes
glues
Glues
Temperature Measurement
thermocouples
Thermocouples
Temperature measurement
temperature measurement
Contact
Numerical Modeling
Measurement errors
Temperature Field
Measurement Error
Temperature distribution
temperature distribution
Influence

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Modelling and Simulation
  • Condensed Matter Physics
  • Environmental Engineering

Cite this

Numerical estimation of errors of temperature measurements by thermocouples using special glues and pastes. / Kuznetsov, G. V.; Mukhammadeev, K. M.

In: Journal of Engineering Thermophysics, Vol. 19, No. 1, 03.2010, p. 17-22.

Research output: Contribution to journalArticle

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