Abstract
Results of numerical modeling the temperature fields in a thermocouple junction with an ideal junction-material contact and with a gap filled with a special glue (or paste) near any boundary of the junction are presented. The influence of the conditions of the thermocouple-material surface contact on the temperature measurement error is estimated.
Original language | English |
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Pages (from-to) | 17-22 |
Number of pages | 6 |
Journal | Journal of Engineering Thermophysics |
Volume | 19 |
Issue number | 1 |
DOIs | |
Publication status | Published - Mar 2010 |
ASJC Scopus subject areas
- Energy Engineering and Power Technology
- Modelling and Simulation
- Condensed Matter Physics
- Environmental Engineering