Novel Ceramic-Based Material for the Applications of Molded Interconnect Devices (3D-MID) Based on Laser Direct Structuring

Bassim Bachy, Robert Süß-Wolf, Li Wang, Zongwen Fu, Nahum Travitzky, Peter Greil, Jörg Franke

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Molded interconnect devices (MID) based on laser direct structuring LPKF-LDS® technology are widely used in the realm of electronics. Nowaday, design and development of new materials with improved properties for 3D-MID are in focus. In this work, novel materials based on alumina ceramic with copper oxide additives are developed for this technology. The effect of the sintering temperature and the doping amount of copper oxide on the metallization quality is investigated. Furthermore, the influence of laser process parameters (e.g., laser power, velocity’, and frequency) on process output namely groove dimensions, groove profile, characteristics of structured area, and quality of the final 3D-MID products are discussed. The novel ceramic materials show high flexibility to realize very fine structures. Moreover, the laser-structured and metallized area shows a free edge lap with good quality. After metallization high accuracy with copper line/pitch of 16 μm/20 μm is achieved.

Original languageEnglish
Article number1700824
JournalAdvanced Engineering Materials
Volume20
Issue number7
DOIs
Publication statusPublished - 1 Jul 2018

Fingerprint

ceramics
Copper oxides
Lasers
copper oxides
Metallizing
grooves
lasers
Aluminum Oxide
Ceramic materials
Copper
sintering
flexibility
Electronic equipment
Alumina
Sintering
aluminum oxides
fine structure
Doping (additives)
copper
output

Keywords

  • High-Performance Ceramics
  • Laser Direct Structuring
  • Molded Interconnect Devices

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Novel Ceramic-Based Material for the Applications of Molded Interconnect Devices (3D-MID) Based on Laser Direct Structuring. / Bachy, Bassim; Süß-Wolf, Robert; Wang, Li; Fu, Zongwen; Travitzky, Nahum; Greil, Peter; Franke, Jörg.

In: Advanced Engineering Materials, Vol. 20, No. 7, 1700824, 01.07.2018.

Research output: Contribution to journalArticle

Bachy, Bassim ; Süß-Wolf, Robert ; Wang, Li ; Fu, Zongwen ; Travitzky, Nahum ; Greil, Peter ; Franke, Jörg. / Novel Ceramic-Based Material for the Applications of Molded Interconnect Devices (3D-MID) Based on Laser Direct Structuring. In: Advanced Engineering Materials. 2018 ; Vol. 20, No. 7.
@article{1efb8946847241898307d0fb5e190218,
title = "Novel Ceramic-Based Material for the Applications of Molded Interconnect Devices (3D-MID) Based on Laser Direct Structuring",
abstract = "Molded interconnect devices (MID) based on laser direct structuring LPKF-LDS{\circledR} technology are widely used in the realm of electronics. Nowaday, design and development of new materials with improved properties for 3D-MID are in focus. In this work, novel materials based on alumina ceramic with copper oxide additives are developed for this technology. The effect of the sintering temperature and the doping amount of copper oxide on the metallization quality is investigated. Furthermore, the influence of laser process parameters (e.g., laser power, velocity’, and frequency) on process output namely groove dimensions, groove profile, characteristics of structured area, and quality of the final 3D-MID products are discussed. The novel ceramic materials show high flexibility to realize very fine structures. Moreover, the laser-structured and metallized area shows a free edge lap with good quality. After metallization high accuracy with copper line/pitch of 16 μm/20 μm is achieved.",
keywords = "High-Performance Ceramics, Laser Direct Structuring, Molded Interconnect Devices",
author = "Bassim Bachy and Robert S{\"u}{\ss}-Wolf and Li Wang and Zongwen Fu and Nahum Travitzky and Peter Greil and J{\"o}rg Franke",
year = "2018",
month = "7",
day = "1",
doi = "10.1002/adem.201700824",
language = "English",
volume = "20",
journal = "Advanced Engineering Materials",
issn = "1438-1656",
publisher = "Wiley-VCH Verlag",
number = "7",

}

TY - JOUR

T1 - Novel Ceramic-Based Material for the Applications of Molded Interconnect Devices (3D-MID) Based on Laser Direct Structuring

AU - Bachy, Bassim

AU - Süß-Wolf, Robert

AU - Wang, Li

AU - Fu, Zongwen

AU - Travitzky, Nahum

AU - Greil, Peter

AU - Franke, Jörg

PY - 2018/7/1

Y1 - 2018/7/1

N2 - Molded interconnect devices (MID) based on laser direct structuring LPKF-LDS® technology are widely used in the realm of electronics. Nowaday, design and development of new materials with improved properties for 3D-MID are in focus. In this work, novel materials based on alumina ceramic with copper oxide additives are developed for this technology. The effect of the sintering temperature and the doping amount of copper oxide on the metallization quality is investigated. Furthermore, the influence of laser process parameters (e.g., laser power, velocity’, and frequency) on process output namely groove dimensions, groove profile, characteristics of structured area, and quality of the final 3D-MID products are discussed. The novel ceramic materials show high flexibility to realize very fine structures. Moreover, the laser-structured and metallized area shows a free edge lap with good quality. After metallization high accuracy with copper line/pitch of 16 μm/20 μm is achieved.

AB - Molded interconnect devices (MID) based on laser direct structuring LPKF-LDS® technology are widely used in the realm of electronics. Nowaday, design and development of new materials with improved properties for 3D-MID are in focus. In this work, novel materials based on alumina ceramic with copper oxide additives are developed for this technology. The effect of the sintering temperature and the doping amount of copper oxide on the metallization quality is investigated. Furthermore, the influence of laser process parameters (e.g., laser power, velocity’, and frequency) on process output namely groove dimensions, groove profile, characteristics of structured area, and quality of the final 3D-MID products are discussed. The novel ceramic materials show high flexibility to realize very fine structures. Moreover, the laser-structured and metallized area shows a free edge lap with good quality. After metallization high accuracy with copper line/pitch of 16 μm/20 μm is achieved.

KW - High-Performance Ceramics

KW - Laser Direct Structuring

KW - Molded Interconnect Devices

UR - http://www.scopus.com/inward/record.url?scp=85044321466&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85044321466&partnerID=8YFLogxK

U2 - 10.1002/adem.201700824

DO - 10.1002/adem.201700824

M3 - Article

AN - SCOPUS:85044321466

VL - 20

JO - Advanced Engineering Materials

JF - Advanced Engineering Materials

SN - 1438-1656

IS - 7

M1 - 1700824

ER -