New investigation possibilities on forward biased power devices using cross sections

T. Kociniewski, J. Moussodji, Z. Khatir, M. Berkani, S. Lefebvre, S. Azzopardi

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)


For the first time, it is demonstrated in this letter that high-power silicon devices [diodes and insulated gate bipolar transistor (IGBTs)] can be forward biased and remains functional after cross sections. Sample preparation is presented, and electrical characterizations of a high-power diode and IGBT (600 V-200 A) have been performed in steady on-state. Infrared thermography on the cross-section surface using a macro-lens with high spatial resolution has allowed characterizing the vertical thermal distribution inside the power diode during forward bias. The impact of this work is that it opens a wide field of investigation in high-power semiconductor device characterization under forward bias.

Original languageEnglish
Article number6151010
Pages (from-to)576-578
Number of pages3
JournalIEEE Electron Device Letters
Issue number4
Publication statusPublished - 1 Apr 2012
Externally publishedYes


  • Cross section
  • electrical characterization
  • failure analysis
  • IGBT
  • power devices
  • power diode
  • thermal characterization
  • thermal mapping

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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