Molecular dynamics simulation of copper bicrystal response to shear loading

A. I. Dmitriev, A. Yu Nikonov, S. G. Psakhie

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

The behavior of a large-angle grain boundary of the Σ = 5 (210)[001] special type in a copper bicrystal under shear loading conditions has been computer simulated. It is established that, simultaneously with the relative slippage of grains in the direction of applied load, the grain boundary shifts in the direction perpendicular to that of shear straining. This motion of the grain boundary exhibits a discrete character and leads to a growth of one grain at the expense of another. The mechanism of this displacement is analyzed and the influence of the loading rate and direction on the character of grain boundary motion is studied. The obtained results provide better understanding of the atomic mechanisms of plastic strain development in polycrystalline materials.

Original languageEnglish
Pages (from-to)786-788
Number of pages3
JournalTechnical Physics Letters
Volume36
Issue number9
DOIs
Publication statusPublished - 8 Oct 2010

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bicrystals
grain boundaries
molecular dynamics
shear
copper
simulation
loading rate
plastics
shift

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Molecular dynamics simulation of copper bicrystal response to shear loading. / Dmitriev, A. I.; Nikonov, A. Yu; Psakhie, S. G.

In: Technical Physics Letters, Vol. 36, No. 9, 08.10.2010, p. 786-788.

Research output: Contribution to journalArticle

Dmitriev, A. I. ; Nikonov, A. Yu ; Psakhie, S. G. / Molecular dynamics simulation of copper bicrystal response to shear loading. In: Technical Physics Letters. 2010 ; Vol. 36, No. 9. pp. 786-788.
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