Abstract
The development and production of highly perfect semiconductor materials and their application in components in various branches of technology requires information on their structural perfection. Of crucial importance is the relationship between structural properties and all the technological processing steps, starting from the raw material right up to the completed device. The availability of reliable experimental facilities at synchrotron radiation sources, with unique properties such as high intensity, small focus, high brilliance, and good coherence at the sample opens up advanced possibilities with application potential also for nondestructive testing and characterization of materials and components from research and industry. We illustrate principles and instrumentation of full field imaging methods with synchrotron radiation and examples of application to x-ray inspection, structure and defect analysis. The aim of direct-space imaging methods is the use of the principles of physical interaction for the imaging of micro-structures. Struct. Variations and Defects in A Wide Fld. of Applic.. X-ray Imaging Methods Using Synchrt. Radiat. Have the Potential to Bridge the Gap between Conventional 2D and 3D Direct Imaging Techniques Using Lab. Sources and Electron Microscopic Methods, That Means to Probe the Reg. between 10 im and A Few Nm. Synchrt. Radiat. Is Furthermore Favorable to Investigate Hidden Int. Struct. at Highest Level of Image Contrast and Resolution of Fine Details. X-ray Imaging Methods Are Essentially Non-destructive and Allow the Use and Combination of Various Contrast Mechanisms for the Imaging of the Geometric, Crystallographic, Chem. and Electron. Struct. of Sample Mat.
| Original language | German |
|---|---|
| Pages (from-to) | 642-651 |
| Number of pages | 10 |
| Journal | Materialpruefung/Materials Testing |
| Volume | 51 |
| Issue number | 10 |
| Publication status | Published - 2009 |
ASJC Scopus subject areas
- Mechanical Engineering
- Mechanics of Materials
- Materials Science(all)
Cite this
Moderne 2-D und 3-D abbildende Röntgenverfahren mit Synchrotronstrahlung. / Baumbach, Tilo; Rolo, T. Dos Santos; Ershov, A.; Helfen, Lukas; Lübbert, Daniel; Modregger, P.; Pelliccia, Danielle; Vagovic, Patrik; Xu, Feng.
In: Materialpruefung/Materials Testing, Vol. 51, No. 10, 2009, p. 642-651.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Moderne 2-D und 3-D abbildende Röntgenverfahren mit Synchrotronstrahlung
AU - Baumbach, Tilo
AU - Rolo, T. Dos Santos
AU - Ershov, A.
AU - Helfen, Lukas
AU - Lübbert, Daniel
AU - Modregger, P.
AU - Pelliccia, Danielle
AU - Vagovic, Patrik
AU - Xu, Feng
PY - 2009
Y1 - 2009
N2 - The development and production of highly perfect semiconductor materials and their application in components in various branches of technology requires information on their structural perfection. Of crucial importance is the relationship between structural properties and all the technological processing steps, starting from the raw material right up to the completed device. The availability of reliable experimental facilities at synchrotron radiation sources, with unique properties such as high intensity, small focus, high brilliance, and good coherence at the sample opens up advanced possibilities with application potential also for nondestructive testing and characterization of materials and components from research and industry. We illustrate principles and instrumentation of full field imaging methods with synchrotron radiation and examples of application to x-ray inspection, structure and defect analysis. The aim of direct-space imaging methods is the use of the principles of physical interaction for the imaging of micro-structures. Struct. Variations and Defects in A Wide Fld. of Applic.. X-ray Imaging Methods Using Synchrt. Radiat. Have the Potential to Bridge the Gap between Conventional 2D and 3D Direct Imaging Techniques Using Lab. Sources and Electron Microscopic Methods, That Means to Probe the Reg. between 10 im and A Few Nm. Synchrt. Radiat. Is Furthermore Favorable to Investigate Hidden Int. Struct. at Highest Level of Image Contrast and Resolution of Fine Details. X-ray Imaging Methods Are Essentially Non-destructive and Allow the Use and Combination of Various Contrast Mechanisms for the Imaging of the Geometric, Crystallographic, Chem. and Electron. Struct. of Sample Mat.
AB - The development and production of highly perfect semiconductor materials and their application in components in various branches of technology requires information on their structural perfection. Of crucial importance is the relationship between structural properties and all the technological processing steps, starting from the raw material right up to the completed device. The availability of reliable experimental facilities at synchrotron radiation sources, with unique properties such as high intensity, small focus, high brilliance, and good coherence at the sample opens up advanced possibilities with application potential also for nondestructive testing and characterization of materials and components from research and industry. We illustrate principles and instrumentation of full field imaging methods with synchrotron radiation and examples of application to x-ray inspection, structure and defect analysis. The aim of direct-space imaging methods is the use of the principles of physical interaction for the imaging of micro-structures. Struct. Variations and Defects in A Wide Fld. of Applic.. X-ray Imaging Methods Using Synchrt. Radiat. Have the Potential to Bridge the Gap between Conventional 2D and 3D Direct Imaging Techniques Using Lab. Sources and Electron Microscopic Methods, That Means to Probe the Reg. between 10 im and A Few Nm. Synchrt. Radiat. Is Furthermore Favorable to Investigate Hidden Int. Struct. at Highest Level of Image Contrast and Resolution of Fine Details. X-ray Imaging Methods Are Essentially Non-destructive and Allow the Use and Combination of Various Contrast Mechanisms for the Imaging of the Geometric, Crystallographic, Chem. and Electron. Struct. of Sample Mat.
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M3 - Статья
AN - SCOPUS:71049164760
VL - 51
SP - 642
EP - 651
JO - Materialpruefung/Materials Testing
JF - Materialpruefung/Materials Testing
SN - 0025-5300
IS - 10
ER -