Modal testing circuit board assembly of an electronic apparatus by laser vibrometry

V. A. Krasnoveikin, Igor Yu Smolin, N. V. Druzhinin, E. A. Kolubaev, D. A. Derusova

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

The operating capacity and service life of printed circuit boards in various electronic equipment and devices depends on their ability to resist vibroacoustic loads, including vibration and acoustic noises. In this paper, non-contact laser vibrometry has been applied to perform the modal analysis of a circuit board assembly in order to identify its vulnerable spots and to find solutions to protect the assembly from external vibroacoustic loads. A broadband periodic chirp signal was used to excite vibration, which enabled a rapid generation of results. The paper provides data on eigenfrequencies, vibration velocity fields, and vibration displacement profiles. Frequency ranges have been determined in which eigenfrequencies with the highest vibration amplification lie. The obtained data can be used to develop a quality control technique for printed circuit boards and to optimize their construction as early as the design stage.

Original languageEnglish
Article number012005
JournalIOP Conference Series: Materials Science and Engineering
Volume156
Issue number1
DOIs
Publication statusPublished - 8 Nov 2016
Externally publishedYes

Fingerprint

Printed circuit boards
Networks (circuits)
Lasers
Testing
Modal analysis
Acoustic noise
Service life
Vibrations (mechanical)
Quality control
Amplification
Electronic equipment

ASJC Scopus subject areas

  • Materials Science(all)
  • Engineering(all)

Cite this

Modal testing circuit board assembly of an electronic apparatus by laser vibrometry. / Krasnoveikin, V. A.; Smolin, Igor Yu; Druzhinin, N. V.; Kolubaev, E. A.; Derusova, D. A.

In: IOP Conference Series: Materials Science and Engineering, Vol. 156, No. 1, 012005, 08.11.2016.

Research output: Contribution to journalArticle

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