Microstructure of amorphous copper-carbon thin films formed by plasma-enhanced chemical vapor deposition

M. V. Astashynskaya, V. V. Astashynski, N. T. Kvasov, V. V. Uglov

Research School of High-Energy Physics

Research output: Contribution to journal › Article

Abstract

The microstructure of copper-carbon Cu/a–C:H nanocomposites formed by plasma-enhanced chemical vapor deposition has been determined by transmission electron microscopy. The formation of spherical copper inclusions embedded in the matrix of amorphous carbon was observed. The average size of the copper inclusions decreases from 16 to 5 nm on increasing the carbon concentration from 8 to 75 at.%. A description of the copper clusters formation processes in the reactor chamber was proposed. The results of calculation of the average size of copper clusters are in good agreement with the observed size of the copper inclusions formed in nanocomposite thin films.

Original language	English
Pages (from-to)	115-126
Number of pages	12
Journal	High Temperature Material Processes
Volume	20
Issue number	2
DOIs	https://doi.org/10.1615/HighTempMatProc.2016017797
Publication status	Published - 1 Jan 2016

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Keywords

Cu/a–C:H composite thin films
Microstructure
Nanoclusters
Plasmaenhanced chemical vapor deposition

ASJC Scopus subject areas

Condensed Matter Physics
Engineering(all)
Materials Science(all)
Energy Engineering and Power Technology
Spectroscopy
Physical and Theoretical Chemistry

Cite this

Astashynskaya, M. V., Astashynski, V. V., Kvasov, N. T., & Uglov, V. V. (2016). Microstructure of amorphous copper-carbon thin films formed by plasma-enhanced chemical vapor deposition. High Temperature Material Processes, 20(2), 115-126. https://doi.org/10.1615/HighTempMatProc.2016017797

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10.1615/HighTempMatProc.2016017797