Microstructure and properties of the composite on the basis of copper and diamond

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The paper presents the experimental material on obtaining and researching of threedimensional composite heat-conducting copper-diamond materials in the system of spark plasma sintering. Earlier [1-5], it was established that in order to achieve the effect of the increased heat conductivity of a composite it is necessary to create the conditions hindering the movement of heat flux on the interface boundary. In this work we have attempted to obtain the material with heat conductivity higher than that of pure copper due to addition of diamond powder and synthesis of the composite in the system of spark plasma sintering. For comparison, we have considered copper and diamond compositions in the ratios of 50/50 and 40/60 correspondingly. The results of the heat conductivity analysis have not exceeded the indices of pure copper; however, according to SEM data, it has been found that at SPS-sintering local domains with enhanced adhesion form on the surfaces of diamonds.

Original languageEnglish
Title of host publicationKey Engineering Materials
PublisherTrans Tech Publications Ltd
Pages607-610
Number of pages4
Volume685
ISBN (Print)9783038357087
DOIs
Publication statusPublished - 2016
Event4th International Conference for Young Scientists High Technology: Research and Applications, HTRA 2015 - Tomsk, Russian Federation
Duration: 21 Apr 201524 Apr 2015

Publication series

NameKey Engineering Materials
Volume685
ISSN (Print)10139826

Conference

Conference4th International Conference for Young Scientists High Technology: Research and Applications, HTRA 2015
CountryRussian Federation
CityTomsk
Period21.4.1524.4.15

Fingerprint

Diamond
Copper
Diamonds
Thermal conductivity
Microstructure
Spark plasma sintering
Composite materials
Powders
Heat flux
Sintering
Adhesion
Scanning electron microscopy
Chemical analysis

Keywords

  • Composite
  • Copper
  • Diamond
  • Heat conductivity

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Ivashutenko, A. S., Martyushev, N. V., & Drozdov, Y. Y. (2016). Microstructure and properties of the composite on the basis of copper and diamond. In Key Engineering Materials (Vol. 685, pp. 607-610). (Key Engineering Materials; Vol. 685). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.685.607

Microstructure and properties of the composite on the basis of copper and diamond. / Ivashutenko, Alexander Sergeevich; Martyushev, Nikita V.; Drozdov, Yuriy Yu.

Key Engineering Materials. Vol. 685 Trans Tech Publications Ltd, 2016. p. 607-610 (Key Engineering Materials; Vol. 685).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ivashutenko, AS, Martyushev, NV & Drozdov, YY 2016, Microstructure and properties of the composite on the basis of copper and diamond. in Key Engineering Materials. vol. 685, Key Engineering Materials, vol. 685, Trans Tech Publications Ltd, pp. 607-610, 4th International Conference for Young Scientists High Technology: Research and Applications, HTRA 2015, Tomsk, Russian Federation, 21.4.15. https://doi.org/10.4028/www.scientific.net/KEM.685.607
Ivashutenko AS, Martyushev NV, Drozdov YY. Microstructure and properties of the composite on the basis of copper and diamond. In Key Engineering Materials. Vol. 685. Trans Tech Publications Ltd. 2016. p. 607-610. (Key Engineering Materials). https://doi.org/10.4028/www.scientific.net/KEM.685.607
Ivashutenko, Alexander Sergeevich ; Martyushev, Nikita V. ; Drozdov, Yuriy Yu. / Microstructure and properties of the composite on the basis of copper and diamond. Key Engineering Materials. Vol. 685 Trans Tech Publications Ltd, 2016. pp. 607-610 (Key Engineering Materials).
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