Microstructural features of wear-resistant titanium nitride coatings deposited by different methods

Sergei V. Fortuna, Yurii P. Sharkeev, Anthony J. Perry, Jesse N. Matossian, Ivan A. Shulepov

Research output: Contribution to journalArticle

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Abstract

Titanium nitride, TiN, is used as wear protective and decorative coatings in various applications. These coatings are deposited by standard industrial methods such as chemical and physical vapor deposition (CVD and PVD, respectively), including magnetron sputtering or its modifications [e.g. the plasma-enhanced magnetron sputtered deposition (PMD) method]. The coatings have different microstructures (size and morphology of grains, orientation, dislocation structure, residual stress, etc.) depending on the method used and the deposition regime. The results of comparative transmission electron microscopy (TEM) investigations of the microstructure of thin TiN coatings deposited by classical CVD and PVD, including PMD, are presented. The microstructure was studied in sections perpendicular and parallel to the coating surface. The grain size was estimated from dark field images and the residual stress was determined using the bend extinction contours in the bright field images. It was found that the coatings deposited by PVD and CVD methods have different grain microstructures and residual stresses. The CVD coatings have an equiaxed microcrystalline structure with very low levels of the local residual stress. The mean grain size is 0.4-0.6 μm. The PVD coatings (Balzers and Metaplas) have a non-equilibrium submicron grain structure with a high level of the local residual stress equal to 0.06-0.08E, where E is Young's modulus, and a mean grain size of 0.1-0.2 μm in the section parallel to the coating surface. The PMD coating structure is highly non-equilibrium nanocrystalline, with a very high level of residual stress equal to 0.13E and a much finer grain size of 0.06 μm.

Original languageEnglish
Pages (from-to)512-517
Number of pages6
JournalThin Solid Films
Volume377-378
DOIs
Publication statusPublished - 1 Dec 2000

Fingerprint

Titanium nitride
titanium nitrides
Wear of materials
coatings
Coatings
Physical vapor deposition
residual stress
Residual stresses
Chemical vapor deposition
vapor deposition
grain size
microstructure
Microstructure
Plasmas
titanium nitride
protective coatings
Crystal microstructure
Magnetron sputtering
modulus of elasticity
magnetron sputtering

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Cite this

Microstructural features of wear-resistant titanium nitride coatings deposited by different methods. / Fortuna, Sergei V.; Sharkeev, Yurii P.; Perry, Anthony J.; Matossian, Jesse N.; Shulepov, Ivan A.

In: Thin Solid Films, Vol. 377-378, 01.12.2000, p. 512-517.

Research output: Contribution to journalArticle

Fortuna, Sergei V. ; Sharkeev, Yurii P. ; Perry, Anthony J. ; Matossian, Jesse N. ; Shulepov, Ivan A. / Microstructural features of wear-resistant titanium nitride coatings deposited by different methods. In: Thin Solid Films. 2000 ; Vol. 377-378. pp. 512-517.
@article{36a03fb4068249e39bffe75bff5a7c21,
title = "Microstructural features of wear-resistant titanium nitride coatings deposited by different methods",
abstract = "Titanium nitride, TiN, is used as wear protective and decorative coatings in various applications. These coatings are deposited by standard industrial methods such as chemical and physical vapor deposition (CVD and PVD, respectively), including magnetron sputtering or its modifications [e.g. the plasma-enhanced magnetron sputtered deposition (PMD) method]. The coatings have different microstructures (size and morphology of grains, orientation, dislocation structure, residual stress, etc.) depending on the method used and the deposition regime. The results of comparative transmission electron microscopy (TEM) investigations of the microstructure of thin TiN coatings deposited by classical CVD and PVD, including PMD, are presented. The microstructure was studied in sections perpendicular and parallel to the coating surface. The grain size was estimated from dark field images and the residual stress was determined using the bend extinction contours in the bright field images. It was found that the coatings deposited by PVD and CVD methods have different grain microstructures and residual stresses. The CVD coatings have an equiaxed microcrystalline structure with very low levels of the local residual stress. The mean grain size is 0.4-0.6 μm. The PVD coatings (Balzers and Metaplas) have a non-equilibrium submicron grain structure with a high level of the local residual stress equal to 0.06-0.08E, where E is Young's modulus, and a mean grain size of 0.1-0.2 μm in the section parallel to the coating surface. The PMD coating structure is highly non-equilibrium nanocrystalline, with a very high level of residual stress equal to 0.13E and a much finer grain size of 0.06 μm.",
author = "Fortuna, {Sergei V.} and Sharkeev, {Yurii P.} and Perry, {Anthony J.} and Matossian, {Jesse N.} and Shulepov, {Ivan A.}",
year = "2000",
month = "12",
day = "1",
doi = "10.1016/S0040-6090(00)01438-3",
language = "English",
volume = "377-378",
pages = "512--517",
journal = "Thin Solid Films",
issn = "0040-6090",
publisher = "Elsevier",

}

TY - JOUR

T1 - Microstructural features of wear-resistant titanium nitride coatings deposited by different methods

AU - Fortuna, Sergei V.

AU - Sharkeev, Yurii P.

AU - Perry, Anthony J.

AU - Matossian, Jesse N.

AU - Shulepov, Ivan A.

PY - 2000/12/1

Y1 - 2000/12/1

N2 - Titanium nitride, TiN, is used as wear protective and decorative coatings in various applications. These coatings are deposited by standard industrial methods such as chemical and physical vapor deposition (CVD and PVD, respectively), including magnetron sputtering or its modifications [e.g. the plasma-enhanced magnetron sputtered deposition (PMD) method]. The coatings have different microstructures (size and morphology of grains, orientation, dislocation structure, residual stress, etc.) depending on the method used and the deposition regime. The results of comparative transmission electron microscopy (TEM) investigations of the microstructure of thin TiN coatings deposited by classical CVD and PVD, including PMD, are presented. The microstructure was studied in sections perpendicular and parallel to the coating surface. The grain size was estimated from dark field images and the residual stress was determined using the bend extinction contours in the bright field images. It was found that the coatings deposited by PVD and CVD methods have different grain microstructures and residual stresses. The CVD coatings have an equiaxed microcrystalline structure with very low levels of the local residual stress. The mean grain size is 0.4-0.6 μm. The PVD coatings (Balzers and Metaplas) have a non-equilibrium submicron grain structure with a high level of the local residual stress equal to 0.06-0.08E, where E is Young's modulus, and a mean grain size of 0.1-0.2 μm in the section parallel to the coating surface. The PMD coating structure is highly non-equilibrium nanocrystalline, with a very high level of residual stress equal to 0.13E and a much finer grain size of 0.06 μm.

AB - Titanium nitride, TiN, is used as wear protective and decorative coatings in various applications. These coatings are deposited by standard industrial methods such as chemical and physical vapor deposition (CVD and PVD, respectively), including magnetron sputtering or its modifications [e.g. the plasma-enhanced magnetron sputtered deposition (PMD) method]. The coatings have different microstructures (size and morphology of grains, orientation, dislocation structure, residual stress, etc.) depending on the method used and the deposition regime. The results of comparative transmission electron microscopy (TEM) investigations of the microstructure of thin TiN coatings deposited by classical CVD and PVD, including PMD, are presented. The microstructure was studied in sections perpendicular and parallel to the coating surface. The grain size was estimated from dark field images and the residual stress was determined using the bend extinction contours in the bright field images. It was found that the coatings deposited by PVD and CVD methods have different grain microstructures and residual stresses. The CVD coatings have an equiaxed microcrystalline structure with very low levels of the local residual stress. The mean grain size is 0.4-0.6 μm. The PVD coatings (Balzers and Metaplas) have a non-equilibrium submicron grain structure with a high level of the local residual stress equal to 0.06-0.08E, where E is Young's modulus, and a mean grain size of 0.1-0.2 μm in the section parallel to the coating surface. The PMD coating structure is highly non-equilibrium nanocrystalline, with a very high level of residual stress equal to 0.13E and a much finer grain size of 0.06 μm.

UR - http://www.scopus.com/inward/record.url?scp=17444434028&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=17444434028&partnerID=8YFLogxK

U2 - 10.1016/S0040-6090(00)01438-3

DO - 10.1016/S0040-6090(00)01438-3

M3 - Article

VL - 377-378

SP - 512

EP - 517

JO - Thin Solid Films

JF - Thin Solid Films

SN - 0040-6090

ER -