Microgap cooling technique based on evaporation of thin liquid films

D. V. Zaitsev, O. A. Kabov

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Thin and very thin (less than 10 μm) liquid films driven by a forced gas/vapor flow (stratified or annular flows), i.e. shear-driven liquid films in a narrow channel is a promising candidate for the thermal management of advanced semiconductor devices in earth and space applications. Development of such technology requires significant advances in fundamental research, since the stability of joint flow of locally heated liquid film and gas is a rather complex problem. The paper focuses on the recent progress that has been achieved by the authors through conducting experiments. Experiments with water in flat channels with height of H=1.2-2.0 mm show that a liquid film driven by the action of a gas flow is stable in a wide range of liquid/gas flow rates. Map of isothermal flow regime was plotted and the length of smooth region was measured. Even for sufficiently high gas flow rates an important thermocapillary effect on film dynamics occurs. Scenario of film rupture differs widely for different flow regimes. It is found that the critical heat flux for a shear driven film can be 10 times higher than that for a falling liquid film, and exceeds 400 W/cm2 in experiments with water for moderate liquid flow rates. This fact makes use of shear-driven liquid films promising in high heat flux chip cooling applications.

Original languageEnglish
Title of host publicationProceedings of the ASME InterPack Conference 2009, IPACK2009
Pages545-551
Number of pages7
Volume2
DOIs
Publication statusPublished - 2010
Event2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States
Duration: 19 Jul 200923 Jul 2009

Other

Other2009 ASME InterPack Conference, IPACK2009
CountryUnited States
CitySan Francisco, CA
Period19.7.0923.7.09

Fingerprint

Liquid films
Evaporation
Cooling
Thin films
Flow of gases
Flow rate
Heat flux
Experiments
Space applications
Liquids
Shear flow
Semiconductor devices
Gases
Temperature control
Water
Earth (planet)
Vapors
Hydrogen

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Zaitsev, D. V., & Kabov, O. A. (2010). Microgap cooling technique based on evaporation of thin liquid films. In Proceedings of the ASME InterPack Conference 2009, IPACK2009 (Vol. 2, pp. 545-551) https://doi.org/10.1115/InterPACK2009-89318

Microgap cooling technique based on evaporation of thin liquid films. / Zaitsev, D. V.; Kabov, O. A.

Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 2 2010. p. 545-551.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zaitsev, DV & Kabov, OA 2010, Microgap cooling technique based on evaporation of thin liquid films. in Proceedings of the ASME InterPack Conference 2009, IPACK2009. vol. 2, pp. 545-551, 2009 ASME InterPack Conference, IPACK2009, San Francisco, CA, United States, 19.7.09. https://doi.org/10.1115/InterPACK2009-89318
Zaitsev DV, Kabov OA. Microgap cooling technique based on evaporation of thin liquid films. In Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 2. 2010. p. 545-551 https://doi.org/10.1115/InterPACK2009-89318
Zaitsev, D. V. ; Kabov, O. A. / Microgap cooling technique based on evaporation of thin liquid films. Proceedings of the ASME InterPack Conference 2009, IPACK2009. Vol. 2 2010. pp. 545-551
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