Microelectromechanical accelerometer under mechanical impact conditions

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The paper presents the effect of mechanical impact on the multiple-axis microelectromechanical system (MEMS) accelerometer. The parameters of accelerometer and its impact load allow considering the impact to be long and displacements induced by this impact to be quasi-static. The impact load results in a contact interaction between the movable and stationary elements of the structure. To prevent the contact interaction, the limit stops are installed in accelerometer. Investigations are carried out using the ANSYS finite element program and MATLAB/Simulink support package. Investigation results are achieved for the displacement and stress values of accelerometer.

Original languageEnglish
Title of host publication2016 International Siberian Conference on Control and Communications, SIBCON 2016 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467383837
DOIs
Publication statusPublished - 14 Jun 2016
Event2016 International Siberian Conference on Control and Communications, SIBCON 2016 - Moscow, Russian Federation
Duration: 12 May 201614 May 2016

Conference

Conference2016 International Siberian Conference on Control and Communications, SIBCON 2016
CountryRussian Federation
CityMoscow
Period12.5.1614.5.16

Fingerprint

Accelerometer
Accelerometers
Contact
MATLAB
MEMS
ANSYS
Matlab/Simulink
Micro-electro-mechanical Systems
Interaction
Finite Element

Keywords

  • contact interaction
  • impact pulse
  • Internet of Things
  • limit stops
  • microelectromechanical accelerometer

ASJC Scopus subject areas

  • Signal Processing
  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Modelling and Simulation
  • Computer Networks and Communications

Cite this

Nesterenko, T., Barbin, E. S., Koleda, A., & Zorina, E. (2016). Microelectromechanical accelerometer under mechanical impact conditions. In 2016 International Siberian Conference on Control and Communications, SIBCON 2016 - Proceedings [7491845] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SIBCON.2016.7491845

Microelectromechanical accelerometer under mechanical impact conditions. / Nesterenko, T.; Barbin, Evgenii Sergeevich; Koleda, A.; Zorina, E.

2016 International Siberian Conference on Control and Communications, SIBCON 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2016. 7491845.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nesterenko, T, Barbin, ES, Koleda, A & Zorina, E 2016, Microelectromechanical accelerometer under mechanical impact conditions. in 2016 International Siberian Conference on Control and Communications, SIBCON 2016 - Proceedings., 7491845, Institute of Electrical and Electronics Engineers Inc., 2016 International Siberian Conference on Control and Communications, SIBCON 2016, Moscow, Russian Federation, 12.5.16. https://doi.org/10.1109/SIBCON.2016.7491845
Nesterenko T, Barbin ES, Koleda A, Zorina E. Microelectromechanical accelerometer under mechanical impact conditions. In 2016 International Siberian Conference on Control and Communications, SIBCON 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2016. 7491845 https://doi.org/10.1109/SIBCON.2016.7491845
Nesterenko, T. ; Barbin, Evgenii Sergeevich ; Koleda, A. ; Zorina, E. / Microelectromechanical accelerometer under mechanical impact conditions. 2016 International Siberian Conference on Control and Communications, SIBCON 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2016.
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