Mechanical behavior and damage of tridimensional multilayered ceramics-tungsten power electronic substrates

Charlotte Robert, Sylvie Pommier, Stephane Lefebvre, Marion Ortali, Michel Massiot

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Since few years a 3D electric lines is developed. But new applications will be to expose this circuit to high variation of temperature and use them for electronic power. Circuits lines are made of tungsten and insulation in alumina. These materials have different behavior. That difference implies mechanics stress and stress singularities. Some stress concentration can fracture materials or interface between them. Alumina is a brittle material. We need to know his fracture behavior. A statistic model is already used: Weibull model. The idea is to break about hundred samples and to related the probabilities to break of alumina used in the circuit versus stress.

Original languageEnglish
Title of host publicationASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012
Pages357-365
Number of pages9
DOIs
Publication statusPublished - 1 Dec 2012
Externally publishedYes
EventASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012 - Nantes, France
Duration: 2 Jul 20124 Jul 2012

Publication series

NameASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012
Volume4

Conference

ConferenceASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012
CountryFrance
CityNantes
Period2.7.124.7.12

Fingerprint

Power electronics
Tungsten
Alumina
Networks (circuits)
Substrates
Brittleness
Stress concentration
Insulation
Electric lines
Mechanics
Statistics
Temperature

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering

Cite this

Robert, C., Pommier, S., Lefebvre, S., Ortali, M., & Massiot, M. (2012). Mechanical behavior and damage of tridimensional multilayered ceramics-tungsten power electronic substrates. In ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012 (pp. 357-365). (ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012; Vol. 4). https://doi.org/10.1115/ESDA2012-82305

Mechanical behavior and damage of tridimensional multilayered ceramics-tungsten power electronic substrates. / Robert, Charlotte; Pommier, Sylvie; Lefebvre, Stephane; Ortali, Marion; Massiot, Michel.

ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012. 2012. p. 357-365 (ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012; Vol. 4).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Robert, C, Pommier, S, Lefebvre, S, Ortali, M & Massiot, M 2012, Mechanical behavior and damage of tridimensional multilayered ceramics-tungsten power electronic substrates. in ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012. ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012, vol. 4, pp. 357-365, ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012, Nantes, France, 2.7.12. https://doi.org/10.1115/ESDA2012-82305
Robert C, Pommier S, Lefebvre S, Ortali M, Massiot M. Mechanical behavior and damage of tridimensional multilayered ceramics-tungsten power electronic substrates. In ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012. 2012. p. 357-365. (ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012). https://doi.org/10.1115/ESDA2012-82305
Robert, Charlotte ; Pommier, Sylvie ; Lefebvre, Stephane ; Ortali, Marion ; Massiot, Michel. / Mechanical behavior and damage of tridimensional multilayered ceramics-tungsten power electronic substrates. ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012. 2012. pp. 357-365 (ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis, ESDA 2012).
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