Laser-Associated Selective Metallization of Ceramic Surface with Infrared Nanosecond Laser Technology

Li Wang, Zongwen Fu, Robert Suess-Wolf, Nahum Travitzky, Peter Greil, Joerg Franke

Research output: Contribution to journalArticle

Abstract

A new approach for the metallization of ceramic substrate by Infrared Nanosecond Laser Technology (INLT) is developed in the present work. The activation of ceramic surface by INLT with a wavelength of 1064 nm promotes the chemical electroless copper plating. The laser associated modification of ceramics in terms of laser ablation is also determined. The ablation threshold for the Al 2 O 3 -Cu 2 O ceramic used in this study is identified at 3.82 and 1.86 J cm −2 with respect to single pulse irradiation and multiple pulses irradiation, respectively. The thickness of plated copper layer on the activated ceramic surface is strongly dependent on the laser fluence and can reach the maximum thickness at the fluence nearby the ablation threshold.

Original languageEnglish
Article number1900096
JournalAdvanced Engineering Materials
DOIs
Publication statusPublished - 1 Jan 2019

Fingerprint

Infrared lasers
Ablation
Metallizing
infrared lasers
Irradiation
ceramics
Copper plating
Lasers
Electroless plating
Laser ablation
lasers
Copper
Chemical activation
ablation
fluence
Wavelength
Substrates
copper
irradiation
thresholds

Keywords

  • ablation threshold
  • laser ablation
  • metallization of ceramic
  • nanosecond laser technology

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Laser-Associated Selective Metallization of Ceramic Surface with Infrared Nanosecond Laser Technology. / Wang, Li; Fu, Zongwen; Suess-Wolf, Robert; Travitzky, Nahum; Greil, Peter; Franke, Joerg.

In: Advanced Engineering Materials, 01.01.2019.

Research output: Contribution to journalArticle

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