Ion-implanted nanodimensional intermetallic phases

I. A. Kurzina

    Research output: Contribution to journalArticle

    Abstract

    Fundamental and technological aspects of using nanointermetallic compounds for the ion-implanted layers as the strengthening phases are studied. The theoretical and experimental data available at present are analyzed, and high properties of nanodimensional intermetallic compounds are projected. The results of the experimental microstructure and phase composition of the surface ion-implanted nickel and tungsten layers formed under conditions of a high-intensity implantation of aluminum and titanium ions arepresented. It is shown that the ion implantation of metal ions makes it possible to create the ultrafine inter-metallic phases A3B and AB (A = Ni, Ti; B = Al, Ti) along with solid solutions of a depth-varying composition in 3000-nm-thick surface layers. The general patterns of formation of the nanodimensional intermetallic phases in the metal matrices are revealed.

    Original languageEnglish
    Pages (from-to)254-269
    Number of pages16
    JournalInorganic Materials: Applied Research
    Volume1
    Issue number3
    DOIs
    Publication statusPublished - Jul 2010

    Fingerprint

    Intermetallics
    Ions
    Ion implantation
    Tungsten
    Titanium
    Nickel
    Aluminum
    Phase composition
    Metal ions
    Solid solutions
    Metals
    Microstructure
    Chemical analysis
    titanium nickelide
    Ultrafine

    Keywords

    • Ion-implant doping
    • Microstructure
    • Nanointermetallic compounds
    • Phase composition

    ASJC Scopus subject areas

    • Materials Science(all)
    • Engineering(all)

    Cite this

    Ion-implanted nanodimensional intermetallic phases. / Kurzina, I. A.

    In: Inorganic Materials: Applied Research, Vol. 1, No. 3, 07.2010, p. 254-269.

    Research output: Contribution to journalArticle

    Kurzina, I. A. / Ion-implanted nanodimensional intermetallic phases. In: Inorganic Materials: Applied Research. 2010 ; Vol. 1, No. 3. pp. 254-269.
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