Abstract
High-power pulsed dc magnetron discharges for ionized high-rate sputtering of copper films were investigated. The repetition frequency was 1 kHz at a fixed 20% duty cycle and argon pressures of 0.5 Pa and 5 Pa. Time evolutions of the discharge characteristics were measured at a target power density in a pulse up to 950 W/cm2. Time-averaged mass spectroscopy was performed at substrate positions. It was shown that copper ions are strongly dominant (up to 92%) in total ion fluxes onto the substrate. Their energy distributions with a broadened low-energy part at a lower pressure are extended to higher energies (up to 45 eV relative to ground potential for the target-to-substrate distance of 100 mm).
Original language | English |
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Article number | 45002 |
Journal | EPL |
Volume | 77 |
Issue number | 4 |
DOIs | |
Publication status | Published - 1 Feb 2007 |
ASJC Scopus subject areas
- Physics and Astronomy(all)