TY - GEN
T1 - Inverse thermal model of temperature-to-power mapping for GaN systems
AU - Zhang, Shuangfeng
AU - Laboure, Eric
AU - Labrousse, Denis
AU - Lefebvre, Stéphane
PY - 2018/1/1
Y1 - 2018/1/1
N2 - This paper deals with the problem of measurement of the losses in Power GaN chips due to almost impossibility to measure the current under the penalty of adding parasitic inductances incompatible with the switching speeds of these components. For this purpose, this paper investigates the steady-state inverse heat conduction model (IHCM) developed from thermal simulations. The main objective is to derive the power dissipation in a GaN chip mounted on or embedded in a PCB from the surface temperature measured by infrared thermography or thermal sensors. In this problem, the power devices losses are the solutions of the inverse problem of the temperature-to-power mapping. IHCM here is based on simple observations from real PCB structures with GaN chip embedded in PCB substrates. The error of the resultant power map with thermal noises is minimized by Least-Square Optimization, which transforms the direct inverse problem into a constrained optimization problem.
AB - This paper deals with the problem of measurement of the losses in Power GaN chips due to almost impossibility to measure the current under the penalty of adding parasitic inductances incompatible with the switching speeds of these components. For this purpose, this paper investigates the steady-state inverse heat conduction model (IHCM) developed from thermal simulations. The main objective is to derive the power dissipation in a GaN chip mounted on or embedded in a PCB from the surface temperature measured by infrared thermography or thermal sensors. In this problem, the power devices losses are the solutions of the inverse problem of the temperature-to-power mapping. IHCM here is based on simple observations from real PCB structures with GaN chip embedded in PCB substrates. The error of the resultant power map with thermal noises is minimized by Least-Square Optimization, which transforms the direct inverse problem into a constrained optimization problem.
KW - Inverse model
KW - Least-square optimization
KW - PCB substrates
KW - Power losses estimation
KW - Temperature-to-power mapping
UR - http://www.scopus.com/inward/record.url?scp=85066976625&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85066976625&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85066976625
SN - 9783800746460
T3 - PCIM Europe Conference Proceedings
SP - 939
EP - 943
BT - PCIM Europe Conference Proceedings
A2 - Scharf, Achim
PB - Mesago PCIM GmbH
T2 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018
Y2 - 5 June 2018 through 7 June 2018
ER -