Abstract
This paper deals with the problem of measurement of the losses in Power GaN chips due to almost impossibility to measure the current under the penalty of adding parasitic inductances incompatible with the switching speeds of these components. For this purpose, this paper investigates the steady-state inverse heat conduction model (IHCM) developed from thermal simulations. The main objective is to derive the power dissipation in a GaN chip mounted on or embedded in a PCB from the surface temperature measured by infrared thermography or thermal sensors. In this problem, the power devices losses are the solutions of the inverse problem of the temperature-to-power mapping. IHCM here is based on simple observations from real PCB structures with GaN chip embedded in PCB substrates. The error of the resultant power map with thermal noises is minimized by Least-Square Optimization, which transforms the direct inverse problem into a constrained optimization problem.
| Original language | English |
|---|---|
| Title of host publication | PCIM Europe Conference Proceedings |
| Editors | Achim Scharf |
| Publisher | Mesago PCIM GmbH |
| Pages | 939-943 |
| Number of pages | 5 |
| Edition | 225809 |
| ISBN (Print) | 9783800746460 |
| Publication status | Published - 1 Jan 2018 |
| Externally published | Yes |
| Event | International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018 - Nuremberg, Germany Duration: 5 Jun 2018 → 7 Jun 2018 |
Publication series
| Name | PCIM Europe Conference Proceedings |
|---|---|
| Number | 225809 |
| ISSN (Electronic) | 2191-3358 |
Conference
| Conference | International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2018 |
|---|---|
| Country | Germany |
| City | Nuremberg |
| Period | 5.6.18 → 7.6.18 |
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Keywords
- Inverse model
- Least-square optimization
- PCB substrates
- Power losses estimation
- Temperature-to-power mapping
ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Inverse thermal model of temperature-to-power mapping for GaN systems. / Zhang, Shuangfeng; Laboure, Eric; Labrousse, Denis; Lefebvre, Stéphane.
PCIM Europe Conference Proceedings. ed. / Achim Scharf. 225809. ed. Mesago PCIM GmbH, 2018. p. 939-943 (PCIM Europe Conference Proceedings; No. 225809).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Inverse thermal model of temperature-to-power mapping for GaN systems
AU - Zhang, Shuangfeng
AU - Laboure, Eric
AU - Labrousse, Denis
AU - Lefebvre, Stéphane
PY - 2018/1/1
Y1 - 2018/1/1
N2 - This paper deals with the problem of measurement of the losses in Power GaN chips due to almost impossibility to measure the current under the penalty of adding parasitic inductances incompatible with the switching speeds of these components. For this purpose, this paper investigates the steady-state inverse heat conduction model (IHCM) developed from thermal simulations. The main objective is to derive the power dissipation in a GaN chip mounted on or embedded in a PCB from the surface temperature measured by infrared thermography or thermal sensors. In this problem, the power devices losses are the solutions of the inverse problem of the temperature-to-power mapping. IHCM here is based on simple observations from real PCB structures with GaN chip embedded in PCB substrates. The error of the resultant power map with thermal noises is minimized by Least-Square Optimization, which transforms the direct inverse problem into a constrained optimization problem.
AB - This paper deals with the problem of measurement of the losses in Power GaN chips due to almost impossibility to measure the current under the penalty of adding parasitic inductances incompatible with the switching speeds of these components. For this purpose, this paper investigates the steady-state inverse heat conduction model (IHCM) developed from thermal simulations. The main objective is to derive the power dissipation in a GaN chip mounted on or embedded in a PCB from the surface temperature measured by infrared thermography or thermal sensors. In this problem, the power devices losses are the solutions of the inverse problem of the temperature-to-power mapping. IHCM here is based on simple observations from real PCB structures with GaN chip embedded in PCB substrates. The error of the resultant power map with thermal noises is minimized by Least-Square Optimization, which transforms the direct inverse problem into a constrained optimization problem.
KW - Inverse model
KW - Least-square optimization
KW - PCB substrates
KW - Power losses estimation
KW - Temperature-to-power mapping
UR - http://www.scopus.com/inward/record.url?scp=85066976625&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85066976625&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85066976625
SN - 9783800746460
T3 - PCIM Europe Conference Proceedings
SP - 939
EP - 943
BT - PCIM Europe Conference Proceedings
A2 - Scharf, Achim
PB - Mesago PCIM GmbH
ER -