Interphase interactions in Au/V/GaAs junctions

N. K. Maksimova, A. G. Pozdnyakov, V. I. Kravtsov, L. M. Krasil'nikova, N. N. Nikitenkov, M. P. Yakubenya, V. P. Yanovskii

Research output: Contribution to journalArticle

Abstract

The structural-phase transformations in the Au/V/GaAs system which occur during the deposition of coatings and under the action of heat treatment at 100-600°, have been investigated. The following methods have been used for the analysis of the elemental and phase composition of junctions: x-ray structural analysis, reflective electron diffraction, electron microscopy, Auger electron microscopy and secondary ion mass (and energy-mass) spectrometry. It is shown that a thin transition layer is formed during the deposition of vanadium in the boundary with GaAs which contains the intermetallides V-Ga and V-As. The thermally stimulated processes of diffusion and phase formation commence at 400°. After annealing at 500-600°, a large number of compounds are formed (AuGa, AuGa2, AuV3, VAs and V3As were identified) which are inhomogeneously distributed throughout the depth. Lateral structural-phase inhomogeneities are observed in the junction layer. The special features of the interphase interactions in a thin film Au/V/GaAs are determined by the physicochemical properties of the elements constituting the system and, also, by the non-equilibrium conditions under which the reactions occur.

Original languageEnglish
Pages (from-to)2497-2506
Number of pages10
JournalPhysics, chemistry and mechanics of surfaces
Volume7
Issue number10
Publication statusPublished - 1992

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Interphase interactions in Au/V/GaAs junctions'. Together they form a unique fingerprint.

  • Cite this

    Maksimova, N. K., Pozdnyakov, A. G., Kravtsov, V. I., Krasil'nikova, L. M., Nikitenkov, N. N., Yakubenya, M. P., & Yanovskii, V. P. (1992). Interphase interactions in Au/V/GaAs junctions. Physics, chemistry and mechanics of surfaces, 7(10), 2497-2506.