Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment

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Abstract

Mathematical modeling of nonlinear nonstationary temperature fields of a typical printed-circuit assembly of radioelectronic equipment has been performed in a three-dimensional formulation with account for the convective and radiative heat exchange with the environment. On the basis of the data of the numerical experiment the "aging" (degradation) indices of polymer materials under prolonged thermal action have been determined. It has been established that the reliability of an object modeled with account for the real temperature fields is five times lower compared to the realization of normalized thermal conditions.

Original languageEnglish
Pages (from-to)1050-1054
Number of pages5
JournalJournal of Engineering Physics and Thermophysics
Volume80
Issue number5
DOIs
Publication statusPublished - Sep 2007

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ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Mechanical Engineering

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