Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment

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9 Citations (Scopus)

Abstract

Mathematical modeling of nonlinear nonstationary temperature fields of a typical printed-circuit assembly of radioelectronic equipment has been performed in a three-dimensional formulation with account for the convective and radiative heat exchange with the environment. On the basis of the data of the numerical experiment the "aging" (degradation) indices of polymer materials under prolonged thermal action have been determined. It has been established that the reliability of an object modeled with account for the real temperature fields is five times lower compared to the realization of normalized thermal conditions.

Original languageEnglish
Pages (from-to)1050-1054
Number of pages5
JournalJournal of Engineering Physics and Thermophysics
Volume80
Issue number5
DOIs
Publication statusPublished - Sep 2007

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Printed circuits
Polymers
Aging of materials
Temperature distribution
Degradation
Hot Temperature
Experiments

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Mechanical Engineering

Cite this

@article{f40e5df3391142e7aada8bbaa213d5c1,
title = "Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment",
abstract = "Mathematical modeling of nonlinear nonstationary temperature fields of a typical printed-circuit assembly of radioelectronic equipment has been performed in a three-dimensional formulation with account for the convective and radiative heat exchange with the environment. On the basis of the data of the numerical experiment the {"}aging{"} (degradation) indices of polymer materials under prolonged thermal action have been determined. It has been established that the reliability of an object modeled with account for the real temperature fields is five times lower compared to the realization of normalized thermal conditions.",
author = "Kuznetsov, {G. V.} and Kravchenko, {Evgeniy Vladimirovich}",
year = "2007",
month = "9",
doi = "10.1007/s10891-007-0137-2",
language = "English",
volume = "80",
pages = "1050--1054",
journal = "Journal of Engineering Physics and Thermophysics",
issn = "1062-0125",
publisher = "Springer GmbH & Co, Auslieferungs-Gesellschaf",
number = "5",

}

TY - JOUR

T1 - Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment

AU - Kuznetsov, G. V.

AU - Kravchenko, Evgeniy Vladimirovich

PY - 2007/9

Y1 - 2007/9

N2 - Mathematical modeling of nonlinear nonstationary temperature fields of a typical printed-circuit assembly of radioelectronic equipment has been performed in a three-dimensional formulation with account for the convective and radiative heat exchange with the environment. On the basis of the data of the numerical experiment the "aging" (degradation) indices of polymer materials under prolonged thermal action have been determined. It has been established that the reliability of an object modeled with account for the real temperature fields is five times lower compared to the realization of normalized thermal conditions.

AB - Mathematical modeling of nonlinear nonstationary temperature fields of a typical printed-circuit assembly of radioelectronic equipment has been performed in a three-dimensional formulation with account for the convective and radiative heat exchange with the environment. On the basis of the data of the numerical experiment the "aging" (degradation) indices of polymer materials under prolonged thermal action have been determined. It has been established that the reliability of an object modeled with account for the real temperature fields is five times lower compared to the realization of normalized thermal conditions.

UR - http://www.scopus.com/inward/record.url?scp=38349116015&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=38349116015&partnerID=8YFLogxK

U2 - 10.1007/s10891-007-0137-2

DO - 10.1007/s10891-007-0137-2

M3 - Article

AN - SCOPUS:38349116015

VL - 80

SP - 1050

EP - 1054

JO - Journal of Engineering Physics and Thermophysics

JF - Journal of Engineering Physics and Thermophysics

SN - 1062-0125

IS - 5

ER -