Abstract
Mathematical modeling of nonlinear nonstationary temperature fields of a typical printed-circuit assembly of radioelectronic equipment has been performed in a three-dimensional formulation with account for the convective and radiative heat exchange with the environment. On the basis of the data of the numerical experiment the "aging" (degradation) indices of polymer materials under prolonged thermal action have been determined. It has been established that the reliability of an object modeled with account for the real temperature fields is five times lower compared to the realization of normalized thermal conditions.
| Original language | English |
|---|---|
| Pages (from-to) | 1050-1054 |
| Number of pages | 5 |
| Journal | Journal of Engineering Physics and Thermophysics |
| Volume | 80 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - Sep 2007 |
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ASJC Scopus subject areas
- Chemical Engineering(all)
- Mechanical Engineering
Cite this
Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment. / Kuznetsov, G. V.; Kravchenko, Evgeniy Vladimirovich.
In: Journal of Engineering Physics and Thermophysics, Vol. 80, No. 5, 09.2007, p. 1050-1054.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Influence of polymer aging on reliability indices of a typical printed-circuit assembly of radioelectronic equipment
AU - Kuznetsov, G. V.
AU - Kravchenko, Evgeniy Vladimirovich
PY - 2007/9
Y1 - 2007/9
N2 - Mathematical modeling of nonlinear nonstationary temperature fields of a typical printed-circuit assembly of radioelectronic equipment has been performed in a three-dimensional formulation with account for the convective and radiative heat exchange with the environment. On the basis of the data of the numerical experiment the "aging" (degradation) indices of polymer materials under prolonged thermal action have been determined. It has been established that the reliability of an object modeled with account for the real temperature fields is five times lower compared to the realization of normalized thermal conditions.
AB - Mathematical modeling of nonlinear nonstationary temperature fields of a typical printed-circuit assembly of radioelectronic equipment has been performed in a three-dimensional formulation with account for the convective and radiative heat exchange with the environment. On the basis of the data of the numerical experiment the "aging" (degradation) indices of polymer materials under prolonged thermal action have been determined. It has been established that the reliability of an object modeled with account for the real temperature fields is five times lower compared to the realization of normalized thermal conditions.
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UR - http://www.scopus.com/inward/citedby.url?scp=38349116015&partnerID=8YFLogxK
U2 - 10.1007/s10891-007-0137-2
DO - 10.1007/s10891-007-0137-2
M3 - Article
VL - 80
SP - 1050
EP - 1054
JO - Journal of Engineering Physics and Thermophysics
JF - Journal of Engineering Physics and Thermophysics
SN - 1062-0125
IS - 5
ER -