Abstract
A numerical analysis of the influence of microwaves on the thermal conditions of elements of electronic equipment (EE) has been carried out. Investigations have shown that the temperature field of the “polymer-semiconductor-composite” system under the action of microwaves is nonuniform. It has been established that under rather typical operating conditions with increasing electric field intensity there is a considerable increase (from 362 to 387 K) in the maximum temperature of the modeled object. Such a strong influence of microwaves on the thermal conditions of the “polymer-semiconductor-composite” system is comparable to the increase in the ambient temperature by 20 K or the increase in the heat release of the internal source by 30%.
| Original language | English |
|---|---|
| Pages (from-to) | 1381-1389 |
| Number of pages | 9 |
| Journal | Journal of Engineering Physics and Thermophysics |
| Volume | 88 |
| Issue number | 6 |
| DOIs | |
| Publication status | Published - 2015 |
Keywords
- Computational modeling
- Finite difference method
- Microwave heating
- Radio emission
- Unstable thermal conditions
ASJC Scopus subject areas
- Condensed Matter Physics
- Engineering(all)