Increasing wear resistance of copper friction pair with electrically-conductive tribological Cu-Mo-S coatings

S. Yu Zharkov, V. P. Sergeev, Marina Vladimirovna Fedorishcheva, O. V. Sergeev, M. P. Kalashnikov

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The composite solid lubricant Cu-Mo-S coating was produced by pulse magnetron sputtering system. The electrical resistivity of deposited Cu-Mo-S coatings was (22.8±3) × 10-8 Ohm×m. Cu-Mo-S coatings decrease the wear rate of the copper friction pair by 38 times. The decrease in the wear rate occurs owing to the formation of a transferred film on the counterface.

Original languageEnglish
Title of host publicationAdvanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2016: Proceedings of the International Conference on Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2016
PublisherAmerican Institute of Physics Inc.
Volume1783
ISBN (Electronic)9780735414457
DOIs
Publication statusPublished - 10 Nov 2016
EventInternational Conference on Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2016 - Tomsk, Russian Federation
Duration: 19 Sep 201623 Sep 2016

Conference

ConferenceInternational Conference on Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2016
CountryRussian Federation
CityTomsk
Period19.9.1623.9.16

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ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Zharkov, S. Y., Sergeev, V. P., Fedorishcheva, M. V., Sergeev, O. V., & Kalashnikov, M. P. (2016). Increasing wear resistance of copper friction pair with electrically-conductive tribological Cu-Mo-S coatings. In Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2016: Proceedings of the International Conference on Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures 2016 (Vol. 1783). [020234] American Institute of Physics Inc.. https://doi.org/10.1063/1.4966528