Hot target magnetron sputtering for ferromagnetic films deposition

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

This work is an investigation on the operation parameters for Ni films deposition by magnetron sputtering from target working at temperatures higher than the Curie temperature due to magnetic phase transition of the sputtered target, which is partial heat-insulated from the water-cooled magnetron body. The ferro- to paramagnetic transition of the target results in decrease of discharge voltage and rise of discharge current. Thereby, discharge power increases under voltage control mode or hot Ni target sputtering can occur at lower pressures under power control mode. Heating of the Ni target and its ferro- to paramagnetic transition leads to stabilization of the discharge parameters. The changes of the discharge current and power decreased from 10.5% to 2.5% during a single sputtering process under voltage control mode. Moreover, a slight increase of the deposition rates of 20…25% was determined, when hot target sputtering was performed. The XRD assessment showed that Ni films deposited by hot target sputtering have a textured crystal structure with larger grain sizes and lower residual stresses in comparison with cooled Ni target sputtering. When passing from cooled to hot target sputtering, the type of film growth changes from zone 1 to zone T, and surface roughness of Ni films decreased.

Original languageEnglish
Pages (from-to)61-70
Number of pages10
JournalSurface and Coatings Technology
Volume334
DOIs
Publication statusPublished - 25 Jan 2018

Fingerprint

ferromagnetic films
Magnetron sputtering
Sputtering
magnetron sputtering
sputtering
Voltage control
electric potential
Film growth
Curie temperature
Deposition rates
Power control
Residual stresses
Stabilization
Crystal structure
Surface roughness
Phase transitions
Heating
residual stress
Water
surface roughness

Keywords

  • Deposition parameters
  • Hot target
  • Magnetron sputtering
  • Nickel films
  • Structural features

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this

@article{12b57a4cb082409ca14d2c0804978433,
title = "Hot target magnetron sputtering for ferromagnetic films deposition",
abstract = "This work is an investigation on the operation parameters for Ni films deposition by magnetron sputtering from target working at temperatures higher than the Curie temperature due to magnetic phase transition of the sputtered target, which is partial heat-insulated from the water-cooled magnetron body. The ferro- to paramagnetic transition of the target results in decrease of discharge voltage and rise of discharge current. Thereby, discharge power increases under voltage control mode or hot Ni target sputtering can occur at lower pressures under power control mode. Heating of the Ni target and its ferro- to paramagnetic transition leads to stabilization of the discharge parameters. The changes of the discharge current and power decreased from 10.5{\%} to 2.5{\%} during a single sputtering process under voltage control mode. Moreover, a slight increase of the deposition rates of 20…25{\%} was determined, when hot target sputtering was performed. The XRD assessment showed that Ni films deposited by hot target sputtering have a textured crystal structure with larger grain sizes and lower residual stresses in comparison with cooled Ni target sputtering. When passing from cooled to hot target sputtering, the type of film growth changes from zone 1 to zone T, and surface roughness of Ni films decreased.",
keywords = "Deposition parameters, Hot target, Magnetron sputtering, Nickel films, Structural features",
author = "Sidelev, {Dmitrii V.} and Bleykher, {Galina A.} and Grudinin, {Vladislav A.} and Krivobokov, {Valery P.} and Massimiliano Bestetti and Syrtanov, {Maxim S.} and Erofeev, {Evgenii V.}",
year = "2018",
month = "1",
day = "25",
doi = "10.1016/j.surfcoat.2017.11.024",
language = "English",
volume = "334",
pages = "61--70",
journal = "Surface and Coatings Technology",
issn = "0257-8972",
publisher = "Elsevier",

}

TY - JOUR

T1 - Hot target magnetron sputtering for ferromagnetic films deposition

AU - Sidelev, Dmitrii V.

AU - Bleykher, Galina A.

AU - Grudinin, Vladislav A.

AU - Krivobokov, Valery P.

AU - Bestetti, Massimiliano

AU - Syrtanov, Maxim S.

AU - Erofeev, Evgenii V.

PY - 2018/1/25

Y1 - 2018/1/25

N2 - This work is an investigation on the operation parameters for Ni films deposition by magnetron sputtering from target working at temperatures higher than the Curie temperature due to magnetic phase transition of the sputtered target, which is partial heat-insulated from the water-cooled magnetron body. The ferro- to paramagnetic transition of the target results in decrease of discharge voltage and rise of discharge current. Thereby, discharge power increases under voltage control mode or hot Ni target sputtering can occur at lower pressures under power control mode. Heating of the Ni target and its ferro- to paramagnetic transition leads to stabilization of the discharge parameters. The changes of the discharge current and power decreased from 10.5% to 2.5% during a single sputtering process under voltage control mode. Moreover, a slight increase of the deposition rates of 20…25% was determined, when hot target sputtering was performed. The XRD assessment showed that Ni films deposited by hot target sputtering have a textured crystal structure with larger grain sizes and lower residual stresses in comparison with cooled Ni target sputtering. When passing from cooled to hot target sputtering, the type of film growth changes from zone 1 to zone T, and surface roughness of Ni films decreased.

AB - This work is an investigation on the operation parameters for Ni films deposition by magnetron sputtering from target working at temperatures higher than the Curie temperature due to magnetic phase transition of the sputtered target, which is partial heat-insulated from the water-cooled magnetron body. The ferro- to paramagnetic transition of the target results in decrease of discharge voltage and rise of discharge current. Thereby, discharge power increases under voltage control mode or hot Ni target sputtering can occur at lower pressures under power control mode. Heating of the Ni target and its ferro- to paramagnetic transition leads to stabilization of the discharge parameters. The changes of the discharge current and power decreased from 10.5% to 2.5% during a single sputtering process under voltage control mode. Moreover, a slight increase of the deposition rates of 20…25% was determined, when hot target sputtering was performed. The XRD assessment showed that Ni films deposited by hot target sputtering have a textured crystal structure with larger grain sizes and lower residual stresses in comparison with cooled Ni target sputtering. When passing from cooled to hot target sputtering, the type of film growth changes from zone 1 to zone T, and surface roughness of Ni films decreased.

KW - Deposition parameters

KW - Hot target

KW - Magnetron sputtering

KW - Nickel films

KW - Structural features

UR - http://www.scopus.com/inward/record.url?scp=85034574376&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85034574376&partnerID=8YFLogxK

U2 - 10.1016/j.surfcoat.2017.11.024

DO - 10.1016/j.surfcoat.2017.11.024

M3 - Article

AN - SCOPUS:85034574376

VL - 334

SP - 61

EP - 70

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

SN - 0257-8972

ER -