High-speed thermal plasma deposition of copper coating on aluminum surface with strong substrate adhesion and low transient resistivity

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Copper and aluminum are widespread materials and have many applications, especially in the electrical engineering, and their coupling is an important issue. The direct connection of these materials without special preparation leads to increasing the transient resistance and energy loses in the contact place. This paper shows the possibility of copper deposition on aluminum substrates using high-speed thermal plasma jet, generated by a coaxial magnetoplasma accelerator. This method allows forming the uniform coating, having the thickness from 50 to 100 μm, with the strong adhesion to the substrate. It is found that in the considered system the adhesion strength depends on the speed of the material deposition and varies from 1540 MPa to 2520 MPa. Such a strong coupling is achieved due to the presence of the mixing material zone near the interface. The material mixing and the absence of clearly-seen boundary between coating and substrate provides not only the strong adhesion but also allows reducing the transient contact resistance. The value of the transient resistance can be decreased at 2.8 times in comparison with the direct connection of copper and aluminum. The surface roughness of synthesized samples and its influence on the transient contact resistance is also investigated using profilometry analysis. It is shown that increasing the compression force can positively decrease the surface roughness that leads to increasing the contact area and, respectively, to decreasing the transient resistance.

Original languageEnglish
Pages (from-to)63-71
Number of pages9
JournalSurface and Coatings Technology
Volume292
DOIs
Publication statusPublished - 25 Apr 2016

Fingerprint

Plasma Gases
Plasma deposition
thermal plasmas
Aluminum
Copper
adhesion
Adhesion
high speed
contact resistance
aluminum
coatings
copper
Coatings
electrical resistivity
surface roughness
Substrates
electrical engineering
Contact resistance
plasma jets
Surface roughness

Keywords

  • Aluminum
  • Coating deposition
  • Copper
  • Discharge plasma
  • High adhesion strength
  • Transient contact resistivity

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this

@article{eed1bc41cbc242f3924011481231a785,
title = "High-speed thermal plasma deposition of copper coating on aluminum surface with strong substrate adhesion and low transient resistivity",
abstract = "Copper and aluminum are widespread materials and have many applications, especially in the electrical engineering, and their coupling is an important issue. The direct connection of these materials without special preparation leads to increasing the transient resistance and energy loses in the contact place. This paper shows the possibility of copper deposition on aluminum substrates using high-speed thermal plasma jet, generated by a coaxial magnetoplasma accelerator. This method allows forming the uniform coating, having the thickness from 50 to 100 μm, with the strong adhesion to the substrate. It is found that in the considered system the adhesion strength depends on the speed of the material deposition and varies from 1540 MPa to 2520 MPa. Such a strong coupling is achieved due to the presence of the mixing material zone near the interface. The material mixing and the absence of clearly-seen boundary between coating and substrate provides not only the strong adhesion but also allows reducing the transient contact resistance. The value of the transient resistance can be decreased at 2.8 times in comparison with the direct connection of copper and aluminum. The surface roughness of synthesized samples and its influence on the transient contact resistance is also investigated using profilometry analysis. It is shown that increasing the compression force can positively decrease the surface roughness that leads to increasing the contact area and, respectively, to decreasing the transient resistance.",
keywords = "Aluminum, Coating deposition, Copper, Discharge plasma, High adhesion strength, Transient contact resistivity",
author = "Alexander Sivkov and Yuliya Shanenkova and Anastasia Saigash and Ivan Shanenkov",
year = "2016",
month = "4",
day = "25",
doi = "10.1016/j.surfcoat.2016.03.029",
language = "English",
volume = "292",
pages = "63--71",
journal = "Surface and Coatings Technology",
issn = "0257-8972",
publisher = "Elsevier",

}

TY - JOUR

T1 - High-speed thermal plasma deposition of copper coating on aluminum surface with strong substrate adhesion and low transient resistivity

AU - Sivkov, Alexander

AU - Shanenkova, Yuliya

AU - Saigash, Anastasia

AU - Shanenkov, Ivan

PY - 2016/4/25

Y1 - 2016/4/25

N2 - Copper and aluminum are widespread materials and have many applications, especially in the electrical engineering, and their coupling is an important issue. The direct connection of these materials without special preparation leads to increasing the transient resistance and energy loses in the contact place. This paper shows the possibility of copper deposition on aluminum substrates using high-speed thermal plasma jet, generated by a coaxial magnetoplasma accelerator. This method allows forming the uniform coating, having the thickness from 50 to 100 μm, with the strong adhesion to the substrate. It is found that in the considered system the adhesion strength depends on the speed of the material deposition and varies from 1540 MPa to 2520 MPa. Such a strong coupling is achieved due to the presence of the mixing material zone near the interface. The material mixing and the absence of clearly-seen boundary between coating and substrate provides not only the strong adhesion but also allows reducing the transient contact resistance. The value of the transient resistance can be decreased at 2.8 times in comparison with the direct connection of copper and aluminum. The surface roughness of synthesized samples and its influence on the transient contact resistance is also investigated using profilometry analysis. It is shown that increasing the compression force can positively decrease the surface roughness that leads to increasing the contact area and, respectively, to decreasing the transient resistance.

AB - Copper and aluminum are widespread materials and have many applications, especially in the electrical engineering, and their coupling is an important issue. The direct connection of these materials without special preparation leads to increasing the transient resistance and energy loses in the contact place. This paper shows the possibility of copper deposition on aluminum substrates using high-speed thermal plasma jet, generated by a coaxial magnetoplasma accelerator. This method allows forming the uniform coating, having the thickness from 50 to 100 μm, with the strong adhesion to the substrate. It is found that in the considered system the adhesion strength depends on the speed of the material deposition and varies from 1540 MPa to 2520 MPa. Such a strong coupling is achieved due to the presence of the mixing material zone near the interface. The material mixing and the absence of clearly-seen boundary between coating and substrate provides not only the strong adhesion but also allows reducing the transient contact resistance. The value of the transient resistance can be decreased at 2.8 times in comparison with the direct connection of copper and aluminum. The surface roughness of synthesized samples and its influence on the transient contact resistance is also investigated using profilometry analysis. It is shown that increasing the compression force can positively decrease the surface roughness that leads to increasing the contact area and, respectively, to decreasing the transient resistance.

KW - Aluminum

KW - Coating deposition

KW - Copper

KW - Discharge plasma

KW - High adhesion strength

KW - Transient contact resistivity

UR - http://www.scopus.com/inward/record.url?scp=84960540596&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84960540596&partnerID=8YFLogxK

U2 - 10.1016/j.surfcoat.2016.03.029

DO - 10.1016/j.surfcoat.2016.03.029

M3 - Article

VL - 292

SP - 63

EP - 71

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

SN - 0257-8972

ER -