Abstract
An innovative concept in the development of advanced coating deposition and ion implantation method including an application of filtered dc metal plasma and high-frequency short-pulsed negative bias voltage with a duty factor in the range of 10-99% is considered. The systematics of metal ion implantation and metal plasma deposition for conducting and insulating materials were investigated. Experimentally, it has been shown that metal plasma based ion implantation as well as high-concentration metal plasma ion implantation with compensation of ion surface sputtering by metal plasma deposition, as well as ion-assisted coating deposition, can be realized by a variation of bias potential ranging from 0-4 · 103 V, pulse repetition rate smoothly adjusted in the range 2-4.4 · 105 pps and pulse duration ranging from 0.5 to 2 μs. Special features of the material treatment method depending on sample conductivity and thickness, plasma concentration, pulse repetition rate and amplitude and duty factor have been examined. The measurements of the resulting adhesion strength, microhardness investigations of the Ti coatings on the stainless steel and glass-ceramic substrates are presented.
Original language | English |
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Pages (from-to) | 8610-8614 |
Number of pages | 5 |
Journal | Surface and Coatings Technology |
Volume | 201 |
Issue number | 19-20 SPEC. ISS. |
DOIs | |
Publication status | Published - 5 Aug 2007 |
Keywords
- Duty factor
- Metal plasma
- Short-pulsed
ASJC Scopus subject areas
- Surfaces, Coatings and Films
- Condensed Matter Physics
- Surfaces and Interfaces