Heat transfer in cooling systems of microelectronic equipment with partially submerged condensers

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3 Citations (Scopus)

Abstract

The heat transfer in a liquid immersion cooling system for microelectronic equipment was tested. The internal volume of the module was divided into two parts with a special partition. Inert dielectric liquid MD3F was used in the experiments as a working fluid. The proposed system can reduce the influence of noncondensable gas on heat transfer at the vapor space condenser. It was determined that the average heat transfer coefficient does not substantially decrease during the condensation of vapor on the partially submerged tubes; this is due to the effect of the surface-tension-driven pressure gradient which occurs in the film of the condensate.

Original languageEnglish
Pages (from-to)157-162
Number of pages6
JournalIEEE Transactions on Components Packaging and Manufacturing Technology Part A
Volume19
Issue number2
DOIs
Publication statusPublished - 1 Jun 1996

Keywords

  • Condensation
  • Immersion
  • Packaging
  • Thermal management

ASJC Scopus subject areas

  • Engineering(all)

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