Hall-Petch analysis for temperature and strain rate dependent deformation of polycrystalline lead

V. E. Panin, R. W. Armstrong

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

A dislocation pile-up analysis of the Hall-Petch constant kε for the tensile deformation of polycrystalline lead over a wide range of temperature T and at two strain rates has been made. The predicted and experimental Hall-Petch dependencies kε 2 = f (T) are in good agreement. Lower than predicted kε values at very low temperatures are attributed to the high curvature of grain boundaries which experience high localized plasticity and consequent shear banding.

Original languageEnglish
Pages (from-to)35-40
Number of pages6
JournalPhysical Mesomechanics
Volume19
Issue number1
DOIs
Publication statusPublished - 1 Jan 2016

Fingerprint

tensile deformation
piles
plastic properties
strain rate
Strain rate
grain boundaries
Lead
curvature
shear
Hall effect
Piles
Plasticity
Grain boundaries
Temperature
temperature

Keywords

  • agreement between theoretical and experimental Hall-Petch dependencies
  • crystal lattice curvature
  • dislocation pile-up analysis
  • polycrystalline lead
  • shear band development

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Surfaces and Interfaces

Cite this

Hall-Petch analysis for temperature and strain rate dependent deformation of polycrystalline lead. / Panin, V. E.; Armstrong, R. W.

In: Physical Mesomechanics, Vol. 19, No. 1, 01.01.2016, p. 35-40.

Research output: Contribution to journalArticle

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