Abstract
Cooling electronics boxes often requires extraction of high heat fluxes from closed boxes with many heat-producing components. The direct use of ventilation is sometimes limited by demands to use hermetic units or the need to extract heat from a specific place in a large and complicated system. A liquid system introduced inside of the electronic box can be used for this purpose. Unfortunately, metallic heat exchangers have a number of shortcomings in these applications, including significant weight as well as cost and space demands. Polymeric heat exchangers consisting of hollow fibers were proposed a decade ago and can be used as an alternative in such applications. Flexible polymeric hollow fiber heat exchangers were prepared and tested in liquid/air conditions. These heat exchangers use plastic capillaries with an outer diameter of 0.5-0.8 mm and a wall thickness of 10% of the outer diameter. They consist of flexible fibers and can be used in narrow slots and/or in shaped channels. These heat exchangers are effective even in natural convection applications because of their high heat transfer intensity on micro-objects. Experimentally obtained overall heat-transfer coefficients in water/air applications are up to 250 W/m2 K for forced convection and up to 80 W/m2 for natural convection. The use of plastic and non-corrosive materials is advantageous in electronic systems where high heat fluxes must be extracted safely from difficult to access spaces or from hermetically-sealed boxes.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 1143-1147 |
| Number of pages | 5 |
| ISBN (Electronic) | 9781467381215 |
| DOIs | |
| Publication status | Published - 20 Jul 2016 |
| Externally published | Yes |
| Event | 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 - Las Vegas, United States Duration: 31 May 2016 → 3 Jun 2016 |
Publication series
| Name | Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 |
|---|
Conference
| Conference | 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 |
|---|---|
| Country | United States |
| City | Las Vegas |
| Period | 31.5.16 → 3.6.16 |
Fingerprint
Keywords
- Heat transfer coefficient
- liquid cooling of electronic
- polymeric membranes
- thermal management
ASJC Scopus subject areas
- Fluid Flow and Transfer Processes
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Hardware and Architecture
- Mechanics of Materials
Cite this
Flexible polymeric hollow fiber heat exchangers for electronic systems. / Raudensky, Miroslav; Astrouski, Ilya; Brozova, Tereza; Bartuli, Erik.
Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Institute of Electrical and Electronics Engineers Inc., 2016. p. 1143-1147 7517677 (Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Flexible polymeric hollow fiber heat exchangers for electronic systems
AU - Raudensky, Miroslav
AU - Astrouski, Ilya
AU - Brozova, Tereza
AU - Bartuli, Erik
PY - 2016/7/20
Y1 - 2016/7/20
N2 - Cooling electronics boxes often requires extraction of high heat fluxes from closed boxes with many heat-producing components. The direct use of ventilation is sometimes limited by demands to use hermetic units or the need to extract heat from a specific place in a large and complicated system. A liquid system introduced inside of the electronic box can be used for this purpose. Unfortunately, metallic heat exchangers have a number of shortcomings in these applications, including significant weight as well as cost and space demands. Polymeric heat exchangers consisting of hollow fibers were proposed a decade ago and can be used as an alternative in such applications. Flexible polymeric hollow fiber heat exchangers were prepared and tested in liquid/air conditions. These heat exchangers use plastic capillaries with an outer diameter of 0.5-0.8 mm and a wall thickness of 10% of the outer diameter. They consist of flexible fibers and can be used in narrow slots and/or in shaped channels. These heat exchangers are effective even in natural convection applications because of their high heat transfer intensity on micro-objects. Experimentally obtained overall heat-transfer coefficients in water/air applications are up to 250 W/m2 K for forced convection and up to 80 W/m2 for natural convection. The use of plastic and non-corrosive materials is advantageous in electronic systems where high heat fluxes must be extracted safely from difficult to access spaces or from hermetically-sealed boxes.
AB - Cooling electronics boxes often requires extraction of high heat fluxes from closed boxes with many heat-producing components. The direct use of ventilation is sometimes limited by demands to use hermetic units or the need to extract heat from a specific place in a large and complicated system. A liquid system introduced inside of the electronic box can be used for this purpose. Unfortunately, metallic heat exchangers have a number of shortcomings in these applications, including significant weight as well as cost and space demands. Polymeric heat exchangers consisting of hollow fibers were proposed a decade ago and can be used as an alternative in such applications. Flexible polymeric hollow fiber heat exchangers were prepared and tested in liquid/air conditions. These heat exchangers use plastic capillaries with an outer diameter of 0.5-0.8 mm and a wall thickness of 10% of the outer diameter. They consist of flexible fibers and can be used in narrow slots and/or in shaped channels. These heat exchangers are effective even in natural convection applications because of their high heat transfer intensity on micro-objects. Experimentally obtained overall heat-transfer coefficients in water/air applications are up to 250 W/m2 K for forced convection and up to 80 W/m2 for natural convection. The use of plastic and non-corrosive materials is advantageous in electronic systems where high heat fluxes must be extracted safely from difficult to access spaces or from hermetically-sealed boxes.
KW - Heat transfer coefficient
KW - liquid cooling of electronic
KW - polymeric membranes
KW - thermal management
UR - http://www.scopus.com/inward/record.url?scp=84983365245&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84983365245&partnerID=8YFLogxK
U2 - 10.1109/ITHERM.2016.7517677
DO - 10.1109/ITHERM.2016.7517677
M3 - Conference contribution
T3 - Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
SP - 1143
EP - 1147
BT - Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
PB - Institute of Electrical and Electronics Engineers Inc.
ER -