Features of copper coatings growth at high-rate deposition using magnetron sputtering systems with a liquid metal target

G. A. Bleykher, A. O. Borduleva, A. V. Yuryeva, V. P. Krivobokov, J. Lančok, J. Bulíř, J. Drahokoupil, L. Klimša, J. Kopeček, L. Fekete, R. Čtvrtlìk, J. Tomaštik

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

The article focuses on the study of growth conditions for metal coatings during the operation of magnetron sputtering systems with a liquid-phase target. It also discusses the trends of coating properties formation (in terms of copper example) depending on the growth conditions. The data of the experiments and calculations confirm that the appearance of intensive evaporation on the target surface allows increasing more than 10 times the deposition rate and deposited particles flux density in comparison to conventional sputtering with a cooled solid target at the same magnetron power. In the case of the magnetron sputtering system with a liquid-phase target, energy fluxes and particles ones towards the substrate during the coating growth and the substrate heating rate are much greater than at conventional magnetron deposition with a solid target. The combination of calculations and experiments have made it possible to reveal the structure of energy and particles fluxes towards the substrate during the operation of the magnetron sputtering system with a liquid-phase target. The contribution of these fluxes formed by different mechanisms in a wide range of magnetron power has also been found out. The analysis of structural and mechanical properties of copper films being deposited at different energy and particles fluxes ratio towards the substrate has been carried out. It has been found that at intensive evaporation the coating surface is smooth and uniform, and the size of grains decreases. The mechanical properties of coatings (adhesion and microhardness) have got higher values compared to the cases related to only sputtering.

Original languageEnglish
Pages (from-to)111-120
Number of pages10
JournalSurface and Coatings Technology
Volume324
DOIs
Publication statusPublished - 15 Sep 2017

Fingerprint

liquid metals
Deposition rates
Liquid metals
Magnetron sputtering
Copper
magnetron sputtering
Fluxes
coatings
copper
Coatings
Substrates
liquid phases
Sputtering
flux (rate)
Evaporation
Liquids
particle flux density
Metal coatings
sputtering
Mechanical properties

Keywords

  • Coating properties
  • Cu coatings
  • Evaporation
  • High-rate coating deposition
  • Magnetron sputtering

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this

Features of copper coatings growth at high-rate deposition using magnetron sputtering systems with a liquid metal target. / Bleykher, G. A.; Borduleva, A. O.; Yuryeva, A. V.; Krivobokov, V. P.; Lančok, J.; Bulíř, J.; Drahokoupil, J.; Klimša, L.; Kopeček, J.; Fekete, L.; Čtvrtlìk, R.; Tomaštik, J.

In: Surface and Coatings Technology, Vol. 324, 15.09.2017, p. 111-120.

Research output: Contribution to journalArticle

Bleykher, G. A. ; Borduleva, A. O. ; Yuryeva, A. V. ; Krivobokov, V. P. ; Lančok, J. ; Bulíř, J. ; Drahokoupil, J. ; Klimša, L. ; Kopeček, J. ; Fekete, L. ; Čtvrtlìk, R. ; Tomaštik, J. / Features of copper coatings growth at high-rate deposition using magnetron sputtering systems with a liquid metal target. In: Surface and Coatings Technology. 2017 ; Vol. 324. pp. 111-120.
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