Rupture fragile et fatigue des substrats DBC, applications haute temperature

Translated title of the contribution: Fatigue and failure of DBC substrates. High temperature applications

Sylvain Pietranico, Sylvie Pommier, Stéphane Lefebvre, Zoubir Khatir

Research output: Contribution to journal › Article › peer-review

Abstract

Electronic power devices used for transportation applications experience severe temperature variations which promote their thermal fatigue and failure of DBC substrates. The Weibull approach was used to model the brittle fracture of the ceramic layer from a natural defect. Besides, geometric singularities in the upper ceramic/copper interface are at the origin of cracks, which grow by fatigue and finally bifurcate and break the ceramic layer.

Translated title of the contribution	Fatigue and failure of DBC substrates. High temperature applications
Original language	French
Pages (from-to)	271-289
Number of pages	19
Journal	European Journal of Electrical Engineering
Volume	12
Issue number	2
DOIs	https://doi.org/10.3166/EJEE.12.271-289
Publication status	Published - 1 Dec 2009
Externally published	Yes

Keywords

Crack's growth
Modes of request
Probability of failure
Stress intensity factor
Weibull's law

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.3166/EJEE.12.271-289

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@article{8a1bcbfd0d27438fb04dd9365e430c20,

title = "Rupture fragile et fatigue des substrats DBC, applications haute temperature",

abstract = "Electronic power devices used for transportation applications experience severe temperature variations which promote their thermal fatigue and failure of DBC substrates. The Weibull approach was used to model the brittle fracture of the ceramic layer from a natural defect. Besides, geometric singularities in the upper ceramic/copper interface are at the origin of cracks, which grow by fatigue and finally bifurcate and break the ceramic layer.",

keywords = "Crack's growth, Modes of request, Probability of failure, Stress intensity factor, Weibull's law",

author = "Sylvain Pietranico and Sylvie Pommier and St{\'e}phane Lefebvre and Zoubir Khatir",

year = "2009",

month = dec,

day = "1",

doi = "10.3166/EJEE.12.271-289",

language = "Французский",

volume = "12",

pages = "271--289",

journal = "European Journal of Electrical Engineering",

issn = "2103-3641",

publisher = "Hermes Science Publishing Ltd",

number = "2",

}

TY - JOUR

T1 - Rupture fragile et fatigue des substrats DBC, applications haute temperature

AU - Pietranico, Sylvain

AU - Pommier, Sylvie

AU - Lefebvre, Stéphane

AU - Khatir, Zoubir

PY - 2009/12/1

Y1 - 2009/12/1

N2 - Electronic power devices used for transportation applications experience severe temperature variations which promote their thermal fatigue and failure of DBC substrates. The Weibull approach was used to model the brittle fracture of the ceramic layer from a natural defect. Besides, geometric singularities in the upper ceramic/copper interface are at the origin of cracks, which grow by fatigue and finally bifurcate and break the ceramic layer.

AB - Electronic power devices used for transportation applications experience severe temperature variations which promote their thermal fatigue and failure of DBC substrates. The Weibull approach was used to model the brittle fracture of the ceramic layer from a natural defect. Besides, geometric singularities in the upper ceramic/copper interface are at the origin of cracks, which grow by fatigue and finally bifurcate and break the ceramic layer.

KW - Crack's growth

KW - Modes of request

KW - Probability of failure

KW - Stress intensity factor

KW - Weibull's law

UR - http://www.scopus.com/inward/record.url?scp=84859855605&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84859855605&partnerID=8YFLogxK

U2 - 10.3166/EJEE.12.271-289

DO - 10.3166/EJEE.12.271-289

M3 - Статья

AN - SCOPUS:84859855605

VL - 12

SP - 271

EP - 289

JO - European Journal of Electrical Engineering

JF - European Journal of Electrical Engineering

SN - 2103-3641

IS - 2