Rupture fragile et fatigue des substrats DBC, applications haute temperature

Translated title of the contribution: Fatigue and failure of DBC substrates. High temperature applications

Sylvain Pietranico, Sylvie Pommier, Stéphane Lefebvre, Zoubir Khatir

Research output: Contribution to journalArticlepeer-review


Electronic power devices used for transportation applications experience severe temperature variations which promote their thermal fatigue and failure of DBC substrates. The Weibull approach was used to model the brittle fracture of the ceramic layer from a natural defect. Besides, geometric singularities in the upper ceramic/copper interface are at the origin of cracks, which grow by fatigue and finally bifurcate and break the ceramic layer.

Translated title of the contributionFatigue and failure of DBC substrates. High temperature applications
Original languageFrench
Pages (from-to)271-289
Number of pages19
JournalEuropean Journal of Electrical Engineering
Issue number2
Publication statusPublished - 1 Dec 2009
Externally publishedYes


  • Crack's growth
  • Modes of request
  • Probability of failure
  • Stress intensity factor
  • Weibull's law

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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