Abstract
Electronic power devices used for transportation applications experience severe temperature variations which promote their thermal fatigue and failure of DBC substrates. The Weibull approach was used to model the brittle fracture of the ceramic layer from a natural defect. Besides, geometric singularities in the upper ceramic/copper interface are at the origin of cracks, which grow by fatigue and finally bifurcate and break the ceramic layer.
| Translated title of the contribution | Fatigue and failure of DBC substrates. High temperature applications |
|---|---|
| Original language | French |
| Pages (from-to) | 271-289 |
| Number of pages | 19 |
| Journal | European Journal of Electrical Engineering |
| Volume | 12 |
| Issue number | 2 |
| DOIs | |
| Publication status | Published - 1 Dec 2009 |
| Externally published | Yes |
Keywords
- Crack's growth
- Modes of request
- Probability of failure
- Stress intensity factor
- Weibull's law
ASJC Scopus subject areas
- Electrical and Electronic Engineering
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Cite this
Pietranico, S., Pommier, S., Lefebvre, S., & Khatir, Z. (2009). Rupture fragile et fatigue des substrats DBC, applications haute temperature. European Journal of Electrical Engineering, 12(2), 271-289. https://doi.org/10.3166/EJEE.12.271-289