Experimental investigation of the reliability of Printed Circuit Board (PCB)-embedded power dies with pressed contact made of metal foam

Y. Pascal, D. Labrousse, M. Petit, S. Lefebvre, F. Costa

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

A Printed Circuit Board (PCB)-embedding process using pressed metal foam to connect the top-side pads of power dies is considered. The manufacturing process, simple and highly cost-effective, is described in detail; samples are manufactured and their reliability and robustness are characterised. It is shown that thermally cycled prototypes exhibit reliability close to that of Direct Bounded Copper (DBC) substrates. Samples submitted to 150 A-surges have highly scattered reliability. SiC MOSFETs submitted to destructive current limiting tests and repetitive short-circuit tests performed similarly to dies reported in TO247 packages. A discussion on the development of reliability-assessment-methods, especially suited for PCB-embedding processes, is proposed.

Original languageEnglish
Pages (from-to)707-714
Number of pages8
JournalMicroelectronics Reliability
Volume88-90
DOIs
Publication statusPublished - 1 Sep 2018
Externally publishedYes

Fingerprint

metal foams
printed circuits
circuit boards
Printed circuit boards
Foams
Metals
embedding
short circuits
Short circuit currents
Copper
field effect transistors
manufacturing
prototypes
costs
copper
Substrates
Costs

Keywords

  • Aging
  • Metal foam
  • PCB embedding
  • Pressed contact
  • Reliability
  • Robustness
  • Short circuit
  • SiC MOSFET

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

Experimental investigation of the reliability of Printed Circuit Board (PCB)-embedded power dies with pressed contact made of metal foam. / Pascal, Y.; Labrousse, D.; Petit, M.; Lefebvre, S.; Costa, F.

In: Microelectronics Reliability, Vol. 88-90, 01.09.2018, p. 707-714.

Research output: Contribution to journalArticle

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