Evolution of the entropy of dislocation structures with strain in solid solutions of Cu-0.5at.% Al

Yuriy Abzaev, Lyudmila Trishkina, Svetlana Porobova, Anatoliy Klopotov, Victor Alexeevich Vlasov, Vladimir Klopotov

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The study on the evolution of the dislocation structure (DS) parameters with strain of solid solutions of Cu-0.5 at.% Al at different test temperatures has been carried out. It has been shown that in substructures with a disordered type of DS (disorder), the disordered mixtures with non-disoriented cells, as well as mixtures of non-disoriented and disoriented cellular structures, the entropy density increases with strain. It has been shown that formation of the cellular substructure corresponds to a diffuse kinetic phase transition of the 1-st kind in the DS. A jump-like decrease in entropy accompanying this phase transition is associated with the annihilation of dislocations in cellular walls and formation of excess dislocation density.

Original languageEnglish
Title of host publicationMultifunctional Materials
Subtitle of host publicationDevelopment and Application
PublisherTrans Tech Publications Ltd
Pages232-236
Number of pages5
ISBN (Print)9783038357292
DOIs
Publication statusPublished - 1 Jan 2016
Event12th International Conference on Prospects of Fundamental Sciences Development, PFSD 2015 - Tomsk, Russian Federation
Duration: 21 Apr 201524 Apr 2015

Publication series

NameKey Engineering Materials
Volume683
ISSN (Print)1013-9826

Conference

Conference12th International Conference on Prospects of Fundamental Sciences Development, PFSD 2015
CountryRussian Federation
CityTomsk
Period21.4.1524.4.15

Fingerprint

Solid solutions
Entropy
Phase transitions
Kinetics
Temperature

Keywords

  • Dislocation structure
  • Dislocation transformations
  • Shannon entropy
  • Solid solutions of Cu-Al alloys
  • Statistical boltzmann entropy
  • Strain

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Abzaev, Y., Trishkina, L., Porobova, S., Klopotov, A., Vlasov, V. A., & Klopotov, V. (2016). Evolution of the entropy of dislocation structures with strain in solid solutions of Cu-0.5at.% Al. In Multifunctional Materials: Development and Application (pp. 232-236). (Key Engineering Materials; Vol. 683). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.683.232

Evolution of the entropy of dislocation structures with strain in solid solutions of Cu-0.5at.% Al. / Abzaev, Yuriy; Trishkina, Lyudmila; Porobova, Svetlana; Klopotov, Anatoliy; Vlasov, Victor Alexeevich; Klopotov, Vladimir.

Multifunctional Materials: Development and Application. Trans Tech Publications Ltd, 2016. p. 232-236 (Key Engineering Materials; Vol. 683).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abzaev, Y, Trishkina, L, Porobova, S, Klopotov, A, Vlasov, VA & Klopotov, V 2016, Evolution of the entropy of dislocation structures with strain in solid solutions of Cu-0.5at.% Al. in Multifunctional Materials: Development and Application. Key Engineering Materials, vol. 683, Trans Tech Publications Ltd, pp. 232-236, 12th International Conference on Prospects of Fundamental Sciences Development, PFSD 2015, Tomsk, Russian Federation, 21.4.15. https://doi.org/10.4028/www.scientific.net/KEM.683.232
Abzaev Y, Trishkina L, Porobova S, Klopotov A, Vlasov VA, Klopotov V. Evolution of the entropy of dislocation structures with strain in solid solutions of Cu-0.5at.% Al. In Multifunctional Materials: Development and Application. Trans Tech Publications Ltd. 2016. p. 232-236. (Key Engineering Materials). https://doi.org/10.4028/www.scientific.net/KEM.683.232
Abzaev, Yuriy ; Trishkina, Lyudmila ; Porobova, Svetlana ; Klopotov, Anatoliy ; Vlasov, Victor Alexeevich ; Klopotov, Vladimir. / Evolution of the entropy of dislocation structures with strain in solid solutions of Cu-0.5at.% Al. Multifunctional Materials: Development and Application. Trans Tech Publications Ltd, 2016. pp. 232-236 (Key Engineering Materials).
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