Evaluation of substrate technologies under high temperature cycling

Laurent Dupont, Stéphane Lefebvre, Zoubir Khatir, Serge Bontemps

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

This paper presents experimental results on the influence of different structures of ceramic substrates under very high temperature cycles. Test vehicles have been realised by APT Europe. Especially, DCB metallization thickness effects are pointed out in the ceramic fracture and solder delamination due to the high temperature variations. Special substrates, like DAB and Si3N4, are also investigated and compared to classical DCBs. Finally, the paper compares the different technologies under high temperature cycles, in order to identify the main factors that could increase the lifetime expectancy of power modules in such harsh environments.

Original languageEnglish
Title of host publication2006 4th International Conference on Integrated Power Systems, CIPS 2006
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9783800729722
Publication statusPublished - 1 Jan 2006
Externally publishedYes
Event4th International Conference on Integrated Power Systems, CIPS 2006 - Naples, Italy
Duration: 7 Jun 20069 Jun 2006

Publication series

Name2006 4th International Conference on Integrated Power Systems, CIPS 2006

Conference

Conference4th International Conference on Integrated Power Systems, CIPS 2006
CountryItaly
CityNaples
Period7.6.069.6.06

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Energy Engineering and Power Technology
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

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