Evaluation of substrate technologies under high temperature cycling

Abstract

This paper presents experimental results on the influence of different structures of ceramic substrates under very high temperature cycles. Test vehicles have been realised by APT Europe. Especially, DCB metallization thickness effects are pointed out in the ceramic fracture and solder delamination due to the high temperature variations. Special substrates, like DAB and Si₃N₄, are also investigated and compared to classical DCBs. Finally, the paper compares the different technologies under high temperature cycles, in order to identify the main factors that could increase the lifetime expectancy of power modules in such harsh environments.

Original language	English
Title of host publication	2006 4th International Conference on Integrated Power Systems, CIPS 2006
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9783800729722
Publication status	Published - 1 Jan 2006
Externally published	Yes
Event	4th International Conference on Integrated Power Systems, CIPS 2006 - Naples, Italy Duration: 7 Jun 2006 → 9 Jun 2006

Publication series

Name	2006 4th International Conference on Integrated Power Systems, CIPS 2006

Conference

Conference	4th International Conference on Integrated Power Systems, CIPS 2006
Country	Italy
City	Naples
Period	7.6.06 → 9.6.06

ASJC Scopus subject areas

Electrical and Electronic Engineering
Energy Engineering and Power Technology
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials

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Cite this

Dupont, L., Lefebvre, S., Khatir, Z., & Bontemps, S. (2006). Evaluation of substrate technologies under high temperature cycling. In 2006 4th International Conference on Integrated Power Systems, CIPS 2006 [5758029] (2006 4th International Conference on Integrated Power Systems, CIPS 2006). Institute of Electrical and Electronics Engineers Inc..

Evaluation of substrate technologies under high temperature cycling. / Dupont, Laurent; Lefebvre, Stéphane; Khatir, Zoubir; Bontemps, Serge.

2006 4th International Conference on Integrated Power Systems, CIPS 2006. Institute of Electrical and Electronics Engineers Inc., 2006. 5758029 (2006 4th International Conference on Integrated Power Systems, CIPS 2006).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Dupont, L, Lefebvre, S, Khatir, Z & Bontemps, S 2006, Evaluation of substrate technologies under high temperature cycling. in 2006 4th International Conference on Integrated Power Systems, CIPS 2006., 5758029, 2006 4th International Conference on Integrated Power Systems, CIPS 2006, Institute of Electrical and Electronics Engineers Inc., 4th International Conference on Integrated Power Systems, CIPS 2006, Naples, Italy, 7.6.06.

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author = "Laurent Dupont and St{\'e}phane Lefebvre and Zoubir Khatir and Serge Bontemps",

year = "2006",

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N2 - This paper presents experimental results on the influence of different structures of ceramic substrates under very high temperature cycles. Test vehicles have been realised by APT Europe. Especially, DCB metallization thickness effects are pointed out in the ceramic fracture and solder delamination due to the high temperature variations. Special substrates, like DAB and Si3N4, are also investigated and compared to classical DCBs. Finally, the paper compares the different technologies under high temperature cycles, in order to identify the main factors that could increase the lifetime expectancy of power modules in such harsh environments.

AB - This paper presents experimental results on the influence of different structures of ceramic substrates under very high temperature cycles. Test vehicles have been realised by APT Europe. Especially, DCB metallization thickness effects are pointed out in the ceramic fracture and solder delamination due to the high temperature variations. Special substrates, like DAB and Si3N4, are also investigated and compared to classical DCBs. Finally, the paper compares the different technologies under high temperature cycles, in order to identify the main factors that could increase the lifetime expectancy of power modules in such harsh environments.

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