Evaluation of substrate technologies under high temperature cycling

Laurent Dupont, Stéphane Lefebvre, Zoubir Khatir, Serge Bontemps

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

This paper presents experimental results on the influence of different structures of ceramic substrates under very high temperature cycles. Test vehicles have been realised by APT Europe. Especially, DCB metallization thickness effects are pointed out in the ceramic fracture and solder delamination due to the high temperature variations. Special substrates, like DAB and Si3N4, are also investigated and compared to classical DCBs. Finally, the paper compares the different technologies under high temperature cycles, in order to identify the main factors that could increase the lifetime expectancy of power modules in such harsh environments.

Original languageEnglish
Title of host publication2006 4th International Conference on Integrated Power Systems, CIPS 2006
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9783800729722
Publication statusPublished - 1 Jan 2006
Externally publishedYes
Event4th International Conference on Integrated Power Systems, CIPS 2006 - Naples, Italy
Duration: 7 Jun 20069 Jun 2006

Publication series

Name2006 4th International Conference on Integrated Power Systems, CIPS 2006

Conference

Conference4th International Conference on Integrated Power Systems, CIPS 2006
CountryItaly
CityNaples
Period7.6.069.6.06

Fingerprint

Substrates
Metallizing
Delamination
Soldering alloys
Temperature
APT
silicon nitride

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Energy Engineering and Power Technology
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Dupont, L., Lefebvre, S., Khatir, Z., & Bontemps, S. (2006). Evaluation of substrate technologies under high temperature cycling. In 2006 4th International Conference on Integrated Power Systems, CIPS 2006 [5758029] (2006 4th International Conference on Integrated Power Systems, CIPS 2006). Institute of Electrical and Electronics Engineers Inc..

Evaluation of substrate technologies under high temperature cycling. / Dupont, Laurent; Lefebvre, Stéphane; Khatir, Zoubir; Bontemps, Serge.

2006 4th International Conference on Integrated Power Systems, CIPS 2006. Institute of Electrical and Electronics Engineers Inc., 2006. 5758029 (2006 4th International Conference on Integrated Power Systems, CIPS 2006).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Dupont, L, Lefebvre, S, Khatir, Z & Bontemps, S 2006, Evaluation of substrate technologies under high temperature cycling. in 2006 4th International Conference on Integrated Power Systems, CIPS 2006., 5758029, 2006 4th International Conference on Integrated Power Systems, CIPS 2006, Institute of Electrical and Electronics Engineers Inc., 4th International Conference on Integrated Power Systems, CIPS 2006, Naples, Italy, 7.6.06.
Dupont L, Lefebvre S, Khatir Z, Bontemps S. Evaluation of substrate technologies under high temperature cycling. In 2006 4th International Conference on Integrated Power Systems, CIPS 2006. Institute of Electrical and Electronics Engineers Inc. 2006. 5758029. (2006 4th International Conference on Integrated Power Systems, CIPS 2006).
Dupont, Laurent ; Lefebvre, Stéphane ; Khatir, Zoubir ; Bontemps, Serge. / Evaluation of substrate technologies under high temperature cycling. 2006 4th International Conference on Integrated Power Systems, CIPS 2006. Institute of Electrical and Electronics Engineers Inc., 2006. (2006 4th International Conference on Integrated Power Systems, CIPS 2006).
@inproceedings{d2bef5f827a64d80815eb04025cc52df,
title = "Evaluation of substrate technologies under high temperature cycling",
abstract = "This paper presents experimental results on the influence of different structures of ceramic substrates under very high temperature cycles. Test vehicles have been realised by APT Europe. Especially, DCB metallization thickness effects are pointed out in the ceramic fracture and solder delamination due to the high temperature variations. Special substrates, like DAB and Si3N4, are also investigated and compared to classical DCBs. Finally, the paper compares the different technologies under high temperature cycles, in order to identify the main factors that could increase the lifetime expectancy of power modules in such harsh environments.",
author = "Laurent Dupont and St{\'e}phane Lefebvre and Zoubir Khatir and Serge Bontemps",
year = "2006",
month = "1",
day = "1",
language = "English",
series = "2006 4th International Conference on Integrated Power Systems, CIPS 2006",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2006 4th International Conference on Integrated Power Systems, CIPS 2006",
address = "United States",

}

TY - GEN

T1 - Evaluation of substrate technologies under high temperature cycling

AU - Dupont, Laurent

AU - Lefebvre, Stéphane

AU - Khatir, Zoubir

AU - Bontemps, Serge

PY - 2006/1/1

Y1 - 2006/1/1

N2 - This paper presents experimental results on the influence of different structures of ceramic substrates under very high temperature cycles. Test vehicles have been realised by APT Europe. Especially, DCB metallization thickness effects are pointed out in the ceramic fracture and solder delamination due to the high temperature variations. Special substrates, like DAB and Si3N4, are also investigated and compared to classical DCBs. Finally, the paper compares the different technologies under high temperature cycles, in order to identify the main factors that could increase the lifetime expectancy of power modules in such harsh environments.

AB - This paper presents experimental results on the influence of different structures of ceramic substrates under very high temperature cycles. Test vehicles have been realised by APT Europe. Especially, DCB metallization thickness effects are pointed out in the ceramic fracture and solder delamination due to the high temperature variations. Special substrates, like DAB and Si3N4, are also investigated and compared to classical DCBs. Finally, the paper compares the different technologies under high temperature cycles, in order to identify the main factors that could increase the lifetime expectancy of power modules in such harsh environments.

UR - http://www.scopus.com/inward/record.url?scp=84971413291&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84971413291&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84971413291

T3 - 2006 4th International Conference on Integrated Power Systems, CIPS 2006

BT - 2006 4th International Conference on Integrated Power Systems, CIPS 2006

PB - Institute of Electrical and Electronics Engineers Inc.

ER -