Abstract
This paper presents experimental results on the influence of different structures of ceramic substrates under very high temperature cycles. Test vehicles have been realised by APT Europe. Especially, DCB metallization thickness effects are pointed out in the ceramic fracture and solder delamination due to the high temperature variations. Special substrates, like DAB and Si3N4, are also investigated and compared to classical DCBs. Finally, the paper compares the different technologies under high temperature cycles, in order to identify the main factors that could increase the lifetime expectancy of power modules in such harsh environments.
| Original language | English |
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| Title of host publication | 2006 4th International Conference on Integrated Power Systems, CIPS 2006 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Electronic) | 9783800729722 |
| Publication status | Published - 1 Jan 2006 |
| Externally published | Yes |
| Event | 4th International Conference on Integrated Power Systems, CIPS 2006 - Naples, Italy Duration: 7 Jun 2006 → 9 Jun 2006 |
Publication series
| Name | 2006 4th International Conference on Integrated Power Systems, CIPS 2006 |
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Conference
| Conference | 4th International Conference on Integrated Power Systems, CIPS 2006 |
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| Country | Italy |
| City | Naples |
| Period | 7.6.06 → 9.6.06 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Energy Engineering and Power Technology
- Industrial and Manufacturing Engineering
- Electronic, Optical and Magnetic Materials
Cite this
Dupont, L., Lefebvre, S., Khatir, Z., & Bontemps, S. (2006). Evaluation of substrate technologies under high temperature cycling. In 2006 4th International Conference on Integrated Power Systems, CIPS 2006 [5758029] (2006 4th International Conference on Integrated Power Systems, CIPS 2006). Institute of Electrical and Electronics Engineers Inc..