Electron-ion-plasma doping of aluminum surface with copper and titanium - A comparative analysis of the formed structure and properties

Yurii Ivanov, Anatolii Klopotov, Alexandr Potekaev, Olga Krysina, Pavel Moskvin, Elizaveta Petrikova, Olga Ivanova, Nikolaii Tsvetkov, Oleg Tolkachev

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Deposition of a titanium or a copper film onto the surface of commercially pure A7 aluminum and irradiation of the “film/substrate” system with an intense pulsed electron beam are carried out in a single vacuum cycle. Formation of a surface doped layer with a thickness of (20-30) μm is revealed. It is shown that the modified layer has a multiphase structure of a cellular rapid solidification of the submicron- nanosized range. Irradiation parameters are determined. It is established that the developed modification method allows forming a surface doped layer with the microhardness more than 4 times (Ti-Al alloy) or more than 3 times (Cu-Al alloy) greater than the microhardness of A7 aluminum; the wear resistance of the surface alloy Ti-Al exceeds the wear resistance of the initial aluminum in ≈2.4 times; doping of aluminum with copper is accompanied with an increase in the wear resistance of the material in ≈1.5 times.

Original languageEnglish
Title of host publicationRadiation-Thermal Effects and Processes in Inorganic Materials
EditorsSergey Gyngazov
PublisherTrans Tech Publications Ltd
Pages76-81
Number of pages6
ISBN (Print)9783035714500
DOIs
Publication statusPublished - 1 Jan 2018
Event13th International Conference on Radiation-Thermal Effects and Processes in Inorganic Materials, RTEP 2017 - Tomsk, Russian Federation
Duration: 9 Oct 201714 Oct 2017

Publication series

NameKey Engineering Materials
Volume781 KEM
ISSN (Print)1013-9826

Conference

Conference13th International Conference on Radiation-Thermal Effects and Processes in Inorganic Materials, RTEP 2017
CountryRussian Federation
CityTomsk
Period9.10.1714.10.17

Keywords

  • Commercially pure aluminum
  • Copper film
  • Film-substrate system
  • Low-energy high-current electron beams
  • Properties
  • Structure
  • Titanium

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Ivanov, Y., Klopotov, A., Potekaev, A., Krysina, O., Moskvin, P., Petrikova, E., Ivanova, O., Tsvetkov, N., & Tolkachev, O. (2018). Electron-ion-plasma doping of aluminum surface with copper and titanium - A comparative analysis of the formed structure and properties. In S. Gyngazov (Ed.), Radiation-Thermal Effects and Processes in Inorganic Materials (pp. 76-81). (Key Engineering Materials; Vol. 781 KEM). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.781.76