Electron-ion-plasma doping of aluminum surface with copper and titanium - A comparative analysis of the formed structure and properties

Yurii Ivanov, Anatolii Klopotov, Alexandr Potekaev, Olga Krysina, Pavel Moskvin, Elizaveta Petrikova, Olga Ivanova, Nikolaii Tsvetkov, Oleg Tolkachev

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Deposition of a titanium or a copper film onto the surface of commercially pure A7 aluminum and irradiation of the “film/substrate” system with an intense pulsed electron beam are carried out in a single vacuum cycle. Formation of a surface doped layer with a thickness of (20-30) μm is revealed. It is shown that the modified layer has a multiphase structure of a cellular rapid solidification of the submicron- nanosized range. Irradiation parameters are determined. It is established that the developed modification method allows forming a surface doped layer with the microhardness more than 4 times (Ti-Al alloy) or more than 3 times (Cu-Al alloy) greater than the microhardness of A7 aluminum; the wear resistance of the surface alloy Ti-Al exceeds the wear resistance of the initial aluminum in ≈2.4 times; doping of aluminum with copper is accompanied with an increase in the wear resistance of the material in ≈1.5 times.

Original languageEnglish
Title of host publicationRadiation-Thermal Effects and Processes in Inorganic Materials
EditorsSergey Gyngazov
PublisherTrans Tech Publications Ltd
Pages76-81
Number of pages6
ISBN (Print)9783035714500
DOIs
Publication statusPublished - 1 Jan 2018
Event13th International Conference on Radiation-Thermal Effects and Processes in Inorganic Materials, RTEP 2017 - Tomsk, Russian Federation
Duration: 9 Oct 201714 Oct 2017

Publication series

NameKey Engineering Materials
Volume781 KEM
ISSN (Print)1013-9826

Conference

Conference13th International Conference on Radiation-Thermal Effects and Processes in Inorganic Materials, RTEP 2017
CountryRussian Federation
CityTomsk
Period9.10.1714.10.17

Fingerprint

Titanium
Aluminum
Copper
Doping (additives)
Ions
Wear resistance
Plasmas
Electrons
Microhardness
Irradiation
Rapid solidification
Electron beams
Vacuum
Substrates

Keywords

  • Commercially pure aluminum
  • Copper film
  • Film-substrate system
  • Low-energy high-current electron beams
  • Properties
  • Structure
  • Titanium

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Ivanov, Y., Klopotov, A., Potekaev, A., Krysina, O., Moskvin, P., Petrikova, E., ... Tolkachev, O. (2018). Electron-ion-plasma doping of aluminum surface with copper and titanium - A comparative analysis of the formed structure and properties. In S. Gyngazov (Ed.), Radiation-Thermal Effects and Processes in Inorganic Materials (pp. 76-81). (Key Engineering Materials; Vol. 781 KEM). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.781.76

Electron-ion-plasma doping of aluminum surface with copper and titanium - A comparative analysis of the formed structure and properties. / Ivanov, Yurii; Klopotov, Anatolii; Potekaev, Alexandr; Krysina, Olga; Moskvin, Pavel; Petrikova, Elizaveta; Ivanova, Olga; Tsvetkov, Nikolaii; Tolkachev, Oleg.

Radiation-Thermal Effects and Processes in Inorganic Materials. ed. / Sergey Gyngazov. Trans Tech Publications Ltd, 2018. p. 76-81 (Key Engineering Materials; Vol. 781 KEM).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ivanov, Y, Klopotov, A, Potekaev, A, Krysina, O, Moskvin, P, Petrikova, E, Ivanova, O, Tsvetkov, N & Tolkachev, O 2018, Electron-ion-plasma doping of aluminum surface with copper and titanium - A comparative analysis of the formed structure and properties. in S Gyngazov (ed.), Radiation-Thermal Effects and Processes in Inorganic Materials. Key Engineering Materials, vol. 781 KEM, Trans Tech Publications Ltd, pp. 76-81, 13th International Conference on Radiation-Thermal Effects and Processes in Inorganic Materials, RTEP 2017, Tomsk, Russian Federation, 9.10.17. https://doi.org/10.4028/www.scientific.net/KEM.781.76
Ivanov Y, Klopotov A, Potekaev A, Krysina O, Moskvin P, Petrikova E et al. Electron-ion-plasma doping of aluminum surface with copper and titanium - A comparative analysis of the formed structure and properties. In Gyngazov S, editor, Radiation-Thermal Effects and Processes in Inorganic Materials. Trans Tech Publications Ltd. 2018. p. 76-81. (Key Engineering Materials). https://doi.org/10.4028/www.scientific.net/KEM.781.76
Ivanov, Yurii ; Klopotov, Anatolii ; Potekaev, Alexandr ; Krysina, Olga ; Moskvin, Pavel ; Petrikova, Elizaveta ; Ivanova, Olga ; Tsvetkov, Nikolaii ; Tolkachev, Oleg. / Electron-ion-plasma doping of aluminum surface with copper and titanium - A comparative analysis of the formed structure and properties. Radiation-Thermal Effects and Processes in Inorganic Materials. editor / Sergey Gyngazov. Trans Tech Publications Ltd, 2018. pp. 76-81 (Key Engineering Materials).
@inproceedings{5cd055587d504d63b70c89b7813b2925,
title = "Electron-ion-plasma doping of aluminum surface with copper and titanium - A comparative analysis of the formed structure and properties",
abstract = "Deposition of a titanium or a copper film onto the surface of commercially pure A7 aluminum and irradiation of the “film/substrate” system with an intense pulsed electron beam are carried out in a single vacuum cycle. Formation of a surface doped layer with a thickness of (20-30) μm is revealed. It is shown that the modified layer has a multiphase structure of a cellular rapid solidification of the submicron- nanosized range. Irradiation parameters are determined. It is established that the developed modification method allows forming a surface doped layer with the microhardness more than 4 times (Ti-Al alloy) or more than 3 times (Cu-Al alloy) greater than the microhardness of A7 aluminum; the wear resistance of the surface alloy Ti-Al exceeds the wear resistance of the initial aluminum in ≈2.4 times; doping of aluminum with copper is accompanied with an increase in the wear resistance of the material in ≈1.5 times.",
keywords = "Commercially pure aluminum, Copper film, Film-substrate system, Low-energy high-current electron beams, Properties, Structure, Titanium",
author = "Yurii Ivanov and Anatolii Klopotov and Alexandr Potekaev and Olga Krysina and Pavel Moskvin and Elizaveta Petrikova and Olga Ivanova and Nikolaii Tsvetkov and Oleg Tolkachev",
year = "2018",
month = "1",
day = "1",
doi = "10.4028/www.scientific.net/KEM.781.76",
language = "English",
isbn = "9783035714500",
series = "Key Engineering Materials",
publisher = "Trans Tech Publications Ltd",
pages = "76--81",
editor = "Sergey Gyngazov",
booktitle = "Radiation-Thermal Effects and Processes in Inorganic Materials",

}

TY - GEN

T1 - Electron-ion-plasma doping of aluminum surface with copper and titanium - A comparative analysis of the formed structure and properties

AU - Ivanov, Yurii

AU - Klopotov, Anatolii

AU - Potekaev, Alexandr

AU - Krysina, Olga

AU - Moskvin, Pavel

AU - Petrikova, Elizaveta

AU - Ivanova, Olga

AU - Tsvetkov, Nikolaii

AU - Tolkachev, Oleg

PY - 2018/1/1

Y1 - 2018/1/1

N2 - Deposition of a titanium or a copper film onto the surface of commercially pure A7 aluminum and irradiation of the “film/substrate” system with an intense pulsed electron beam are carried out in a single vacuum cycle. Formation of a surface doped layer with a thickness of (20-30) μm is revealed. It is shown that the modified layer has a multiphase structure of a cellular rapid solidification of the submicron- nanosized range. Irradiation parameters are determined. It is established that the developed modification method allows forming a surface doped layer with the microhardness more than 4 times (Ti-Al alloy) or more than 3 times (Cu-Al alloy) greater than the microhardness of A7 aluminum; the wear resistance of the surface alloy Ti-Al exceeds the wear resistance of the initial aluminum in ≈2.4 times; doping of aluminum with copper is accompanied with an increase in the wear resistance of the material in ≈1.5 times.

AB - Deposition of a titanium or a copper film onto the surface of commercially pure A7 aluminum and irradiation of the “film/substrate” system with an intense pulsed electron beam are carried out in a single vacuum cycle. Formation of a surface doped layer with a thickness of (20-30) μm is revealed. It is shown that the modified layer has a multiphase structure of a cellular rapid solidification of the submicron- nanosized range. Irradiation parameters are determined. It is established that the developed modification method allows forming a surface doped layer with the microhardness more than 4 times (Ti-Al alloy) or more than 3 times (Cu-Al alloy) greater than the microhardness of A7 aluminum; the wear resistance of the surface alloy Ti-Al exceeds the wear resistance of the initial aluminum in ≈2.4 times; doping of aluminum with copper is accompanied with an increase in the wear resistance of the material in ≈1.5 times.

KW - Commercially pure aluminum

KW - Copper film

KW - Film-substrate system

KW - Low-energy high-current electron beams

KW - Properties

KW - Structure

KW - Titanium

UR - http://www.scopus.com/inward/record.url?scp=85054794546&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85054794546&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/KEM.781.76

DO - 10.4028/www.scientific.net/KEM.781.76

M3 - Conference contribution

AN - SCOPUS:85054794546

SN - 9783035714500

T3 - Key Engineering Materials

SP - 76

EP - 81

BT - Radiation-Thermal Effects and Processes in Inorganic Materials

A2 - Gyngazov, Sergey

PB - Trans Tech Publications Ltd

ER -